Industry Directory | Consultant / Service Provider / Manufacturer
Gen3 Systems is a specialist manufacturer of test and measurement equipment used to help predict reliability of electronic circuits and systems in the field.
Industry Directory | Consultant / Service Provider
Engelmaier Associates, L.C.is a firm providing consulting services on reliability, manufacturing and
PRISM is the new Reliability Analysis Center (RAC) software tool that ties together several tools into a comprehensive system reliability prediction methodology. The PRISM concept accounts for the myriad of factors that can influence system reliabil
PRISM is the new Reliability Analysis Center (RAC) software tool that ties together several tools into a comprehensive system reliability prediction methodology. The PRISM concept accounts for the myriad of factors that can influence system reliabil
Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Tue Feb 20 16:56:36 EST 2001 | davef
There has been substantial amount of FEA done on predicting BGA ball reliability, but this has most often been applied to assessing the reliability of the design of products, rather than the effects of rework. This sounds like an interesting proje
Used SMT Equipment | Pick and Place/Feeders
Make: JUKI Model: JUKI RX-7R Details:1.High Precision Placement: The SIPLACE X S series offers absolute precision, making it ideal for demanding high-volume production applications such as network infrastructure (5G), large boards for server and ind
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel: SIPLACE XS Details:1.High Precision Placement: The SIPLACE X S series offers absolute precision, making it ideal for demanding high-volume production applications such as network infrastructure (5G), large boards for server and indus
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Parts & Supplies | Assembly Accessories
Advantages of KIC START Cheap price. The temperature curve can be drawn quickly and accurately. Immediate and objective temperature curve analysis Easy to use software Manual temperature curve prediction Reliable and secure hardware 24-Hour cu
Technical Library | 2019-03-06 21:26:14.0
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However, variability in the mechanical properties such as the coefficient of thermal expansion and elastic modulus effects the material selection process by introducing uncertainty to the long term impacts on the reliability of the electronics. Typically, the main reliability issue is solder joint fatigue which accounts for a large amount of failures in electronic components. Therefore, it is necessary to understand the effect of polymer encapsulations (coatings, pottings and underfills) on the solder joints when predicting reliability.This paper presents the construction and validation of a thermo-mechanical tensile fatigue specimen. The thermal cycling range was matched with potting expansion properties in order to vary the magnitude of tensile stress imposed on solder joints
Technical Library | 2023-06-14 01:09:26.0
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Apr 14 00:00:00 EDT 2020 - Tue Apr 14 00:00:00 EDT 2020 | ,
Is Your Reliability Prediction Reliable?
Events Calendar | Mon Feb 20 00:00:00 EST 2023 - Tue Feb 21 00:00:00 EST 2023 | Penang, Malaysia
Managing & Improving Electronic Products Reliability Across the Entire Lifecycle – From Prototype into Volume Manufacture
Career Center | San Jose, Nationwide | Engineering,Management
This world-renowned $13B organization is seeking a Product Reliability Engineering Manager (to report directly into the VP) for our San Jose, CA corporate technology office. We prefer candidates in the Silicon Valley area, but will consider candidat
Career Center | Austin, Texas USA | Engineering
KN Research is assisting it's award-winning high-tech client to fill a Staff Reliability Engineer position. We are seeking an experienced Reliability Engineer with strong skills in hands-on product failure analysis, field failure and internal failur
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
SMTnet Express, December 27, 2019, Subscribers: 33,251, Companies: 10,949, Users: 25,451 A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism Credits: Beihang University PTH plays a critical role in PCB reliability. Thermal
SMTnet Express, September 18, 2014, Subscribers: 23262, Members: Companies: 14045, Users: 36846 Predicting the Lifetime of the PCB - From Experiment to Simulation. Markus Leitgeb; AT&S , Peter Fuchs; PCCL Two major drivers in electronic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=18
Contact Global HQ Africa Asia Central and South America Europe USA and Canada High Strain Rate The high strain rate test methodology can be used for both cold bump pull and shear to predict future failures
| https://productronica.com/en/trade-fair/press/press-releases/detail/iot-and-5g-the-perfect-combination.html
. Other estimates predict more than double that amount. According to Market Research Future , the global market for IoT in manufacturing alone is to grow to USD
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