Industry Directory: preform (14)

ORION Industries

ORION Industries

Industry Directory | Consultant / Service Provider / Distributor / Manufacturer

ORION provides innovative solutions to our customers' EMI/RFI Shielding, Insulating, Screening and Sealing needs in a broad spectrum of manufacturing environments.

INDSOLTECH

Industry Directory | Distributor

Ditributor for Solder Products of Indium Corporation of America. Solder Paste, Pb and Pb free, Flux, Solder Wire, Solder bar, Preforms,Thermal Interface and Solar material and,Engineering solders etc

New SMT Equipment: preform (29)

BGA Reballing Training

New Equipment | Education/Training

In this One-Day class you will learn successful techniques to re-ball BGA Components.  Both Lead and Lead Free Solder Balls will be covered.  The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the

Precision PCB Services, Inc

Reballing Preforms-EZReball™

Reballing Preforms-EZReball™

New Equipment | Rework & Repair Equipment

The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o

BEST Inc.

Electronics Forum: preform (210)

Solder preform supplier

Electronics Forum | Tue Oct 14 15:32:33 EDT 2008 | gregcr

Hi all, Looking for a solder preform supplier. Looking to use small solder washers on a project and looking for a supplier. If anyone has suggestions please let me know. thanks

Solder preform supplier

Electronics Forum | Thu Oct 16 08:00:52 EDT 2008 | floydf

Indium makes them too.

Used SMT Equipment: preform (1)

Hepco 1500-1 radial former

Used SMT Equipment | THT Equipment

We are currently looking for Hepco 1500 radial preformers.    

SMTS LTD.

Industry News: preform (329)

SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab

Industry News | 2018-04-22 19:12:45.0

SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

Technical Library: preform (4)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Minimizing Voiding In QFN Packages Using Solder Preforms

Technical Library | 2012-07-27 11:18:29.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. The focus of this paper will quantify the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing vo

Indium Corporation

Videos: preform (11)

SMT Auto splicing machine - QYSMT

SMT Auto splicing machine - QYSMT

Videos

SMT Auto splicing machine with new design and excellent preformance! Splicing time about 6~8 seconds, compatible with 8MM paper and emboss tapes! More information pls send us email: info@qy-smt.com.

Qinyi Electronics Co.,Ltd

SMT Auto splicing machine - QYSMT

SMT Auto splicing machine - QYSMT

Videos

SMT Auto splicing machine with new design and excellent preformance! Splicing time about 6~8 seconds, compatible with 8MM paper and emboss tapes! More information pls send us email: info@qy-smt.com.

Qinyi Electronics Co.,Ltd

Training Courses: preform (4)

IPC J-STD-001 Specialist (CIS) Certification Training Course

Training Courses | | | IPC J-STD-001 Specialist (CIS)

The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.

Blackfox Training Institute, LLC

IPC J-STD-001 Space Addendum (CIS) Certification Training Course

Training Courses | | | IPC J-STD-001 Space Specialist (CIS)

The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.

Blackfox Training Institute, LLC

Career Center - Jobs: preform (6)

Global Product Applications Engineer

Career Center | South Plainfield, New Jersey USA | Engineering

Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh

MacDermid Alpha Electronics Solutions

Global Applications Manager - Electronic Materials

Career Center | South Plainfield, New Jersey USA | Management,Sales/Marketing

Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh

MacDermid Alpha Electronics Solutions

Career Center - Resumes: preform (1)

Manufacturing head

Career Center | Gurgaon, Haryana India | Management

� Heading daily morning meeting with all program managers, materials manager, test engineering manager, process engineering manager, quality control manager, planning manager, stock room manager, shipping department head. Discussion about incoming or

Express Newsletter: preform (24)

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

Partner Websites: preform (6)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined

Heller Industries Inc.

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

: Communicating With Impact and Developing Your Authentic Presence Jun 24, 2020 Webinar: Europe Chapter: Solder Preform World - Not New Technology but a Very Interesting Option Webinar Jun 25, 2020 Webinar

Surface Mount Technology Association (SMTA)


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