Industry Directory | Manufacturer
EBSO develops and manufactures cutting and bending machines for Thru Hole components and is a competent solution partner around Selective Soldering.
Industry Directory | Manufacturer
Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Electronics Forum | Mon Mar 16 09:23:56 EST 1998 | Justin Medernach
| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. Call 1 800 4 INDIUM and ask for a sales person. A paper
Electronics Forum | Thu Nov 13 12:32:12 EST 2014 | jorge_quijano
Hola, I've used the free e-book that I'm attaching when I implement the first Pin in Paste process, it was helpful. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17555&mc=10 One thing that was helpful was also th
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
Industry News | 2013-09-03 11:52:21.0
BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2009-12-14 20:27:54.0
Solder paste is the most recognized form of solder used in electronics assembly today. A surface mount application depends on solder paste to attach the components to the circuit board. However, solder paste may not be the only solution. This is especially true when working with through-hole components or very large devices that require more solder than can be supplied by printed solder paste. In fact, quite often a PCB involves mixed technology that requires more than one form of solder. Solder paste is used for the surface mount components and solder preforms are utilized to attach the leads on through-hole components, avoiding wave or selective soldering.
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | Gurgaon, Haryana India | Management
� Heading daily morning meeting with all program managers, materials manager, test engineering manager, process engineering manager, quality control manager, planning manager, stock room manager, shipping department head. Discussion about incoming or
Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
were created by mounting a sputtered Silicon die to standard FR4 using a room temperature epoxy. A solder preform and lid were then placed on top of the die, and a graphite fixture was utilized to keep the components properly positioned and held the in
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Tuttle, Cree, Inc. High Power LED Solder Joint Reliability Session 1 - Predicting Component Life + Under harsh environmental conditions like corrosion, radiation, high temperature and vibration, the aging of components is drastically accelerated. Dr
