Industry Directory | Manufacturer
Manufacturer of PCB laminates. The products includes full series of FR-4 copper clad laminates, prepreg,CEM-1,CEM-3, etc.
Industry Directory | Manufacturer
Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
Electronics Forum | Wed Aug 18 02:17:37 EDT 2010 | tennythomas
I heard that one can create the stacked/staggered microvias in the layers 1-2 & 2-3 and skip microvia in the layer 1-3 of 6 layer stack up, when the prepreg is between layers 1 & 2 and the other prepreg is between the layers 2 & 3. I want to know w
Electronics Forum | Wed Jul 22 06:58:50 EDT 2015 | migliore
Hi, I got the answer from edaboard.com A standard 6-layer stack is using 2 cores. Manufacturing steps for standard 6-layer are: 1. Etch both (double side) core substrates 2. Assemble, press and cure the complete stack: - copper foil - prepr
Industry News | 2020-03-08 16:47:51.0
IPC's Validation Services Program has awarded and renewed an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC). TUC is an electronics materials manufacturing company headquartered in Jhubei, Hsinchu County, Taiwan. TUC was the first manufacturer worldwide to gain QPL listing for copper-clad laminates and prepregs in February 2017. TUC successfully renewed and completed an intensive second audit based on IPC's foremost standard on base materials for laminates and prepregs: IPC 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Industry News | 2017-05-15 15:41:33.0
IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Jhubei, Hsinchu County, Taiwan. TUC provides mass lamination services, copper clad laminates and prepregs to the global electronics industry. To earn the QPL, TUC successfully completed an intensive audit based on IPC's foremost standard on base materials for laminates and prepregs: IPC 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Parts & Supplies | Circuit Board Assembly Products
1). Laird aluminium backed 2). T-Prepreg 1KA Dielectric 3). Low Thermal Resistance for Cool & Efficient LED Operation 4). 1.6mm thick, single sided, 1 oz 5). Black solder mask/No ident 6). CNC rout outline 7). Immersion gold
Technical Library | 2020-11-29 22:02:49.0
It has been over 25 years since the earliest edition of "Everything You Ever Wanted to Know About Laminates...but Were Afraid to Ask" was pounded out on an old TRaSh-80 Computer. It has undergone periodic review and editing, including adaption for use on our website. (When I entered the industry Al Gore had not yet invented the internet.) Before I "retired" in 2004, we did another minor revision, but it was largely cosmetic, removing most references to the old military specification and introducing IPC-4101, the "new" specification for laminate and prepreg materials.
Technical Library | 2017-08-24 16:53:20.0
With the rapid development of the information industry, increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In addition to the increasingly high performance requirements of CCL's, the present global attention to less toxic products is leading to an increase in the use of halogen-free flame retardants in electronics. (...) This paper introduces a new phosphonate oligomer which can be used as a reactive flame retardant in epoxy based resin systems. Suitable conditions for the complete reaction between the phosphonate oligomer and epoxy resin are described and the resulting halogen-free laminates with improved properties such as low Df, low coefficient of thermal expansion (CTE), high peel strength, and good toughness are presented.
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/hdi-material-selection_topic3243.html
. Typically, overall thickness for conventional PCBs can be specified from a range of standard thicknesses e.g. 0.6mm, 1.0mm, 1.6mm. Within these thicknesses a range of prepreg, cores and copper are specified to fit the functional requirements of the board
