Industry Directory | Manufacturer
ECM's technology focus is electronic circuit fabrication which compliments EMS's circuit assembly product line.
Industry Directory | Manufacturer
Supplier of high quality engineered materials, including conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks and potting compounds.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
We are well versed in the following thermal application materials: Sil-Pad thermally conductive insulators Gap-Pad thermally conductive gap filling material Q-Pad thermal grease replacement film Bond-Ply thermally conductive adh
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Sat Jun 17 08:57:23 EDT 2000 | Chrys Shea
A few more tricks to try: - Got a hot air rework machine? You can get more controlled heat on the area and lower the risk of damage to the fab. I never got topside fillets un unrelieve ground planes until I went to convection preheat on my waves.
Used SMT Equipment | Pick and Place/Feeders
Universal Instruments Polaris Machine For Sale Very clean and in Good Condition See attached pictures and information below Polaris Model Number: 7514A Equipment Number: 10076306 Year 2008 Travel: 550 mm x 800mm Repeatability: +/- 0.01
Used SMT Equipment | Soldering - Reflow
New arrival, like new condition. Proto-type, small batch LPKF Zelflow R04 Solder Paste Reflow Oven. Very minimal use. Powered up and tested. 220 - 240VAC single phase. FOB: Origin ALSO AVAILABLE: LPKF ZELPRINT LT300 BENCH TOP SOLDER PASTE PRIN
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2016-12-09 23:33:42.0
GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
Parts & Supplies | Circuit Board Assembly Products
1). Laird aluminium backed 2). T-Prepreg 1KA Dielectric 3). Low Thermal Resistance for Cool & Efficient LED Operation 4). 1.6mm thick, single sided, 1 oz 5). Black solder mask/No ident 6). CNC rout outline 7). Immersion gold
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Career Center | , | 2018-02-12 15:39:39.0
MR PCB Rework Technician (Intel Contract Employee) Job Description The IMR PCB rework Technician will be responsible for developing thermal profiles for PCB components, identifying nozzles, revision control, updating/drafting rework instructions,
Career Center | , | 2018-02-13 11:01:27.0
Job Description The IMR PCB rework Technician will be responsible for developing thermal profiles for PCB components, identifying nozzles, revision control, updating/drafting rework instructions, performing soldering workmanship within IPC standards
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
ORION Industries | http://orionindustries.com/pdfs/thermal.pdf
. Sil-Pad , Gap Pad, and Q-Pad are registered trademarks of The Bergquist Company. One Orion Park Drive, Ayer, MA 01432 • Phone: 978-772-6000 • Fax: 978-772-0021 • E-mail: info@orionind.com • www.orionindustries.com ORION INDUSTRIES INCORPORATED GAP PADS Material Thickness Range Thermal Conductivity Gap Pad V0 Soft
Imagineering, Inc. | https://www.pcbnet.com/blog/the-importance-of-thermal-management-in-pcb-manufacturing/
The Importance of Thermal Management in PCB Manufacturing | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
