Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach
| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and
Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon
| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a
| http://etasmt.com/cc?ID=te_news_industry,4161&url=_print
is easily oxidized, often caused problems that solder wetting angle is too largely exposed and copper pad phenomenon. Although a number of electronics manufacturers for operating costs consideration is not temporarily using nitrogen, but with the
40731 | https://www.smta.org/harsh/Harsh-Environments-Program-2019.pdf?v=20052905555
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