New Equipment | Cleaning Equipment
BMP-1000X Automatic SMT Stencil Cleaning Machine BMP-1000X Feature ▶The cleaning tank, the original tank, and the spray tank are designed with a liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric s
http://www.flason-smt.com/product/Siemens-12mm-16mm-original-feeder-00141092.html Siemens 12mm 16mm original feeder 00141092 SMT Spare Parts Seimens feeder Siemens 12mm 16mm original feeder 00141092 Usage: Seimens pick and place machine Produ
Electronics Forum | Tue Apr 26 11:22:48 EDT 2005 | denismeloche
I have found that Sn62 solder gives better strength and leach resistance when soldering to gold surfaces. The gold needs to be at least 5 to 10 micro inches thick to prevent nickel oxidation but if over 25 micro inches will cause brittleness. I hav
Electronics Forum | Tue Dec 01 07:24:44 EST 1998 | Earl Moon
| Hi folks , | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection
Industry News | 2018-10-18 08:04:17.0
Influences of the solder material for the wave soldering machine soldering quality
Industry News | 2018-10-18 09:33:23.0
wave soldering has become the future direction of development
Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
Technical Library | 2023-01-10 20:08:36.0
Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability - all very costly.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
ORPRO Vision SPI Presentation. This presentation introduces the methods and technology used by ORPRO Vision in the Symbion P36 Plus SPI system. For additional information, please contact ORPRO Vision at sales.us@orprovision.com sales.eu@orprovision
Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/counterfeit/
. We do feel it is the BEST counterfeit component prevention training course available in the United States and the world today. Below is the program outline of what you can expect when you select this specialized one of a kind training course
Heller Industries Inc. | https://hellerindustries.com/surface-mount-technology-soldering-equipment-company-of-the-year/
Company of the Year Soldering Equipment - Heller Home » Company of the Year Soldering Equipment Company Of The Year Award (Soldering Equipment) 30th October, 2020 The 2020 Global Surface Mount Technology Soldering Equipment Award
