Industry Directory: print description (3)

KAI Tropical Inc.

Industry Directory |

Brief Description: Tropical Assemblies, Inc. is a 10 + year Electronic Contract Manufacturer of RF and Complex Printed Circuit Board Assemblies. Full turnkey operation from prototyping to full production box builds. On staff RF Engineering and assign

SMTspares.com - Spare SMT/PCB Assembly Parts Locator

Industry Directory | Other

SMTspares.com is a community driven spare parts locator for the SMT and PCB assembly industry. Membership registration takes only a minute and is completely FREE. We link sellers to buyers of parts.

New SMT Equipment: print description (21)

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

New Equipment | Software

ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc.  ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat

UNISOFT Corporation

IPC Standards

IPC Standards

New Equipment | Education/Training

IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics

Association Connecting Electronics Industries (IPC)

Electronics Forum: print description (41)

green stick test

Electronics Forum | Thu Apr 28 17:09:28 EDT 2005 | jsloot

Does anyone have any articles about performing the green stick test for IC leads? If there are no printed articles then perhaps I can get a good description from you on the proper usage of one. I would like to know from your experiences any pros and

Re: Solderability on Immersion Gold

Electronics Forum | Tue Feb 29 14:10:09 EST 2000 | Glenn Robertson

Steve - I believe you should ask who has NOT dealt with this before. Search the archives for "dark pad" or "black pad". It's a common problem for immersion Gold. Does anyone Know any other descriptive names that I missed (and can be printed

Used SMT Equipment: print description (21)

Speedline MPM 3030

Speedline MPM 3030

Used SMT Equipment | Screen Printers

Make: Speedline MPM Model: 3030 Description: Screen Printer Vintage: 1995 Software level: 7.1D Details: • 29 x 29 Max stencil size • Paste Dispenser • Retractor • Programmable squeegee • Electrical Z brake • 2D Post Print Inspection • Vac

Lewis & Clark

Surface Mount Techniques SL2220

Surface Mount Techniques SL2220

Used SMT Equipment | Screen Printers

Surface Mount Techniques Semi-Automatic Printer Equipment Description SMT - Surface Mount Techniques Printer Model Number: SL-2220 Serial Number: 1878 Type: Semi-Automatic Left to Right Shuttle Table Max Frame: 29 x 31 Max Print Area: 21 x 2

1st Place Machinery Inc.

Industry News: print description (88)

NEMI's Test Strategy Project Releases Cost Model

Industry News | 2003-05-22 08:54:17.0

Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies

SMTnet

IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design File

Industry News | 2016-04-07 08:47:23.0

The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: print description (771)

MPM  printing system hard disk of DOS

MPM printing system hard disk of DOS

Parts & Supplies | SMT Equipment

MPM printing system hard disk of DOS Name: MPM printing system hard disk, DOS version of the software Part Number: MPM printing system hard disk, DOS version of the software Description: For AP; APHIE; AP EXCEL; UP2000; UP2000HIE DOS system such

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

MPM  printing system hard disk of DOS

MPM printing system hard disk of DOS

Parts & Supplies | SMT Equipment

MPM printing system hard disk of DOS Name: MPM printing system hard disk, DOS version of the software Part Number: MPM printing system hard disk, DOS version of the software Description: For AP; APHIE; AP EXCEL; UP2000; UP2000HIE DOS system such

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: print description (3)

Step Stencil design when 01005 and 0.3mm pitch uBGA's coexist with RF Shields

Technical Library | 2023-07-25 16:50:02.0

Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.

Photo Stencil LLC

Good Product Quality Comes From Good Design for Test Strategies

Technical Library | 2015-12-17 17:24:17.0

Product quality can be improved through proper application of design for test (DFT) strategies. With today's shrinking product sizes and increasing functionality, it is difficult to get good test coverage of loaded printed circuit boards due to the loss of test access. Advances in test techniques, such as boundary scan, help to recover this loss of test coverage. However, many of these test techniques need to be designed into the product to be effective.This paper will discuss how to maximize the benefits of boundary scan test, including specific examples of how designers should select the right component, connect multiple boundary scan components in chains, add test access to the boundary scan TAP ports, etc. A discussion of DFT guidelines for PCB layout designers is also included. Finally, this paper will include a description of some advanced test methods used in in-circuit tests, such as vectorless test and special probing methods, which are implemented to improve test coverage on printed circuit boards with limited test access.

Agilent Technologies, Inc.

Videos: print description (32)

How to make sure you're using the most recent revision of IPC standards

How to make sure you're using the most recent revision of IPC standards

Videos

IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.

Association Connecting Electronics Industries (IPC)

Air Driven Pneumatic Guillotine PCB Cutter Without Stress

Air Driven Pneumatic Guillotine PCB Cutter Without Stress

Videos

600mm Penumatic V-groove PCB Cutter Linear Blades PCB Separator Penumatic V-groove PCB Cutter Description: In order to improve the output of printed circuit board (PCB) manufacturing and the linear speed of surface mount (SMT), the printed circ

Winsmart Electronic Co.,Ltd

Training Courses: print description (37)

IPC CID Designer Online Live Certification Training

Training Courses | | | IPC Designer Certification CID

The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.

EPTAC Corporation

IPC CID Designer Online Live Certification Training

Training Courses | | | IPC Designer Certification CID

The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.

EPTAC Corporation

Events Calendar: print description (5)

IPC SummerCom

Events Calendar | Sat Jun 15 00:00:00 EDT 2019 - Thu Jun 20 00:00:00 EDT 2019 | Raleigh, North Carolina USA

IPC SummerCom

Association Connecting Electronics Industries (IPC)

SMTA/iNEMI Webinar: Non-Contact Additive Processes for Contemporary Electronics Production

Events Calendar | Tue Aug 11 00:00:00 EDT 2020 - Tue Aug 11 00:00:00 EDT 2020 | ,

SMTA/iNEMI Webinar: Non-Contact Additive Processes for Contemporary Electronics Production

Surface Mount Technology Association (SMTA)

Career Center - Jobs: print description (26)

Senior Manufacturing Process Engineer

Career Center | Boxborough, Massachusetts USA | Engineering

Provide manufacturing engineering support for new and sustaining Appian printed circuit board and electro-mechanical subassemblies. For a detailed job description please see: http://www.appiancom.com/career.htm

Appian Communications

SMT PROCESS ENGINEER (DE1031)

Career Center | Addison,Texas, Texas USA | Engineering

Site Location: Charlotte, NC USA Description: Requires a BSIE or eqivalent and five years of Surface Mount Technology experience with printed circuit boards and components. Using FUJI CP6 CP4 IP2 IP3.STRONG NPI BACKGROUND.

Advanced Communication Solutions

Career Center - Resumes: print description (5)

Manufacturing engineer & SMT process engineer

Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production

PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou

Engineer- SMT

Career Center | , | 2013-01-31 04:29:34.0

• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010

Express Newsletter: print description (963)

Partner Websites: print description (331)

Index of /content/vendors/tiny_mce/plugins/print

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Index of /content/vendors/tiny_mce/plugins/print Index of /content/vendors/tiny_mce/plugins/print   Name Last modified Size Description   Parent Directory   -     editor_plugin.js 2014-07-14 08:44 492     editor_plugin_src.js 2014-07-14 08:44 804  

Letter of apology and clarification of wrong description of relationship between ICT and Rehm-News-R

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Letter of apology and clarification of wrong description of relationship between ICT and Rehm-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About


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