Industry Directory | Manufacturer
XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
Electronics Forum | Mon Mar 30 01:53:15 EDT 2020 | franknguyen
Hi, I have 2k test points need to test by Flying Probe. How can I assume the test cycle time for this? (I use Takaya Flying Probe)
Electronics Forum | Mon Mar 30 04:14:00 EDT 2020 | tbora
I am not sure, but maybe you can see from the monitor of the machine. Doesn't it give to you cycle time ?
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
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Used SMT Equipment | Screen Printers
DEK ASM E by Stencil Printer Premium software Offline programming Modular and retrofittable Variable, semi-automatic stencil mounting Programmable understencil cleaning Short cycle times Process control/monitoring More Details about printers ple
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Parts & Supplies | SMT Equipment
MPM printing system hard(P8466) Name: P8466 MPM printing system hard, WIN NT version of the software Part Number: P8466 Description: For UP2000HIE; NT operating system of the machine Applicable models: UP2000HIE P8466 MPM printing system
Parts & Supplies | SMT Equipment
MPM printing system hard disk of DOS Name: MPM printing system hard disk, DOS version of the software Part Number: MPM printing system hard disk, DOS version of the software Description: For AP; APHIE; AP EXCEL; UP2000; UP2000HIE DOS system such
Technical Library | 2024-06-20 22:53:23.0
A leading electronic hearing device manufacturer reduced UV precise coating cycle time by 79% with advanced automation. A manual process of hand brushing UV coating onto components was replaced by an automated solution from Nordson to increase production volumes, improve quality, and reduce costs for this complex application. Download the paper to learn the details of the application.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Career Center | Orlando, Florida USA | Engineering,Production
MtronPTI is seeking a process engineer to support its Surface Mount production line and general assembly operations Major responsibilities include: �Lead engineering efforts to innovate improvements for electronics production lines �Work with produc
Career Center | Tampa, Florida USA | Accounting/Finance,Production,Purchasing
Reptron Manufacturing Services needs an experienced Assistant Buyer/Planner for their large contract manufacturing facility. The qualified candidate must be a self-starter with an understanding of PC board manufacturing and component procurement with
Career Center | Derabassi, India | Maintenance,Management,Production,Quality Control,Sales/Marketing
PCB Assembly (SMT & PTH)--Process/Planning – Production – Maintenance/Troubleshooting – QA/QC
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
Imagineering, Inc. | https://www.pcbnet.com/blog/ingredients-for-success-with-just-in-time-and-on-time-pcb-delivery/
Ingredients for Success with Just-In-Time and On-Time PCB Delivery Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology
KingFei SMT Tech | http://www.smtspare-parts.com/buy-screen_printing_parts.html
Buy screen printing parts, Good quality screen printing parts manufacturer Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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