25.0µm (>1 mil) Packing: Inner packing: vacuum packing/plastic bag Outer packing: standard carton packing Shape tolerance: ±0.13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05 With UL, SGS and RoHS marks Special requirements: buried and blind via +
New Equipment | Test Equipment
Tebo-ICT is a kind of very professional ICT and ATE fixture software. Chinese interface, designed in humanity, compatible with Win98/2000/NT/XP/7/10 system, which is easy to operate and train. It can cope with all kinds of GERBER and buried via, posi
Electronics Forum | Fri Aug 22 00:25:20 EDT 2003 | mantis
Kenny, Out of curisoty why do you need to paste the vias.Is it due to contact reliability at test.Can these vias not be soldered during wave process (if any).Can the Style of probe used in the ICT test fixture not be changed to accomodate these unsol
Electronics Forum | Fri Aug 22 09:41:49 EDT 2003 | davef
Mantis: Kenny reflows paste on [wave solders] all via, not just the test via, to plug the via and provide for a pressure seal between the board and the test fixture. Beyond that, since solder is softer than copper [and fills the hole better], solde
Industry News | 2018-06-05 20:03:05.0
NCAB Group was today listed on Nasdaq Stockholm. The initial public offering and listing is expected to support NCAB’s future growth and operational strategy, among other things, through improved access to the capital markets as well as a diversified owner base of new Swedish and international shareholders. Nasdaq Stockholm has approved the Company's application for listing, subject to customary conditions.
Industry News | 2007-06-22 11:43:27.0
Richardson, TX (June 19, 2007) � A new edition of the popular Boundary-Scan Tutorial from ASSET InterTech Inc., (www.asset-intertech.com) an international leader in boundary-scan (JTAG/IEEE 1149.1) test and in-system programming (ISP), includes expanded explanations of how to use JTAG as well as totally new sections describing complementary technologies such as the new IEEE 1149.6 Boundary-Scan Standard for Advanced Digital Networks and the IEEE 1532 In-System Configuration Standard.
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
| https://unisoft-cim.com/test-fixture_download.htm
Reference Points: For the Flying Probe ATE we need to set three reference marks on the top of the PC Board. For the first reference mark click TEST-FIXTURE from the main top menu, then click MARK BOARD REFERENCE then click on the bottom of the PC Board any
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=14
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Ball Shear/Solder Ball Shear The solder ball shear test is one of the most common tests undertaken on a bondtester
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
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