Industry Directory | Manufacturer / Other
Manufacturer of Conveyor pull cords, zero speed, misalignment, and plugged chute switches for conveyors.
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Optima Weightech is an acknowledged manufacturer, supplier, trader, and service provider of superior-quality industrial automation and process weighing systems.
Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di
FKN Systek K6000 - Fully automated singulation of up to 10 panels. Singulate Panels with up to 10 Scorelines. Process PCBs with Components up to 2.5" High. Integrated Input and Output Conveyors. Output Conveyor with Loaded Board Detector. Quic
Electronics Forum | Fri Jul 11 09:37:16 EDT 2008 | realchunks
BGAs are actually easy, but proper stencil design, solder paste placement and oven profiles are a must. Especially oven profiles as this is your only indication that the inner balls have reached proper temp, since you cannot visually tell. If you g
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Used SMT Equipment | SMT Equipment
Product name: YC8 small modular chip mounter Product number: YC8 Products in detail Features: support large irregular component small modular placement machine Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard componen
Used SMT Equipment | SMT Equipment
Product name: YC - 8 YAMAHA irregular chip mounter Product number: YC - 8 Products in detail Object substrate: L50 W50mm ~ L330 W360mm x x (1) does When using standard components: absolute accuracy (including + 3 sigma) : + / - 0.05 mm/QFP Rep
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Parts & Supplies | Assembly Accessories
Introduction of kic2000 furnace temperature tester Processing customization: Yes Brand: US KIC Model: kic2000 Measurement range: - 50-1050 (℃) Temperature measurement resolution: 0.1 ℃ Dimension: 320 * 86 * 26 (mm) Packing number: 1 t
Parts & Supplies | Assembly Accessories
KIC START profiler,kic thermal profile,smt thermal profilling Image Reflow Profile 9 6 Channel Tester Accuracy: +/-1.2°C Resolution: 0.3 °C to 0.1 °C Internal operating temperature: 0 °C to 105 °C For thermocouples: 9/12 K Ty
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2019-02-13 13:45:11.0
Development of information and telecommunications network is outstanding in recent years, and it is required for the related equipment such as communication base stations, servers and routers, to process huge amount of data in no time. As an electrical signal becomes faster and faster, how to prevent signal delay by transmission loss is a big issue for Printed Circuit Boards (PCB) loaded on such equipments. There are two main factors as the cause of transmission loss; dielectric loss and conductor loss. To decrease the dielectric loss, materials having low dielectric constant and low loss tangent have been developed. On the other hand, reducing the surface roughness of the copper foil itself to be used or minimizing the surface roughness by modifying surface treatment process of the conductor patterns before lamination is considered to be effective in order to decrease the conductor loss. However, there is a possibility that reduction in the surface roughness of the conductor patterns will lead to the decrease in adhesion of conductor patterns to dielectric resin and result in the deterioration of reliability of PCB itself. In this paper, we will show the evaluation results of adhesion performance and electrical properties using certain type of dielectric material for high frequency PCB, several types of copper foil and several surface treatment processes of the conductor patterns. Moreover, we will indicate a technique from the aspect of surface treatment process in order to ensure reliability and, at the same time, to prevent signal delay at the signal frequency over 20 GHz.
Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. The Nordson YESTECH FX-940U
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
Events Calendar | Wed Sep 12 00:00:00 EDT 2018 - Sun Sep 30 00:00:00 EDT 2018 | ,
Improving Material Dispensing Yield in Manufacturing Applications
Events Calendar | Mon Aug 13 00:00:00 EDT 2018 - Wed Sep 12 00:00:00 EDT 2018 | ,
Improving dispensing yield
Career Center | Williamsport, Pennsylvania USA | Engineering,Quality Control
Spartronics is a leader in complex electronics manufacturing and design services, serving customers in defense, aerospace, space, medical device, instrumentation & control, and life science markets. Spartronics is growing rapidly with manufacturi
Career Center | Brooksville, Florida USA | Engineering,Quality Control
Spartronics develops, manufactures, and manages the full lifecycle of robust electronic and electromechanical devices for commercial aerospace, defense, space, instrumentation and control, life sciences and medical device applications. Our proven exp
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | Gurgaon, India | Engineering,Management,Production,Purchasing,Quality Control
1. Quality Function Management • Ensure timely inspection at incoming, in-process & outgoing stage. • Non-conformance review & reporting. • Decision making - Right disposal of Non-conforming material. • Determination of Vendor Quality rating (VQR
Heller Industries Inc. | https://hellerindustries.com/heller/formic-acid-reflow-process/
. Low O2 ppm levels are essential for a quality formic process. Ensure that O2 levels are <20ppm for all oven zones. The main indicator of a good formic reflow process is whether proper wetting of the solder is occurring
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed
: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3) when in Rev E of J-STD-001 it was a process indicator (P2D3
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