SOS Inventory Software provides top-of-the-line inventory control, order management, and manufacturing for a wide variety of industries, plus integration with QBO, UPS, ShipStation, Shopify, BigCommerce, Zapier and PayPal.
Industry Directory | Consultant / Service Provider
Leading manufacturer of automatic devices for measurement, converting, regulation and registration, transmission and visualization of various industrial process.
New Equipment | Assembly Services
Introduction of kic2000 furnace temperature tester Processing customization: Yes Brand: US KIC Model: kic2000 Measurement range: - 50-1050 (℃) Temperature measurement resolution: 0.1 ℃ Dimension: 320 * 86 * 26 (mm) Packing number: 1 type Ame
High precision smt aoi offline machine pcba offline aoi 2 conveyor aoi Technical parameter: ategory project specifications Visual identity system Discrimin
Electronics Forum | Fri Jul 11 09:37:16 EDT 2008 | realchunks
BGAs are actually easy, but proper stencil design, solder paste placement and oven profiles are a must. Especially oven profiles as this is your only indication that the inner balls have reached proper temp, since you cannot visually tell. If you g
Electronics Forum | Wed Aug 19 16:58:32 EDT 2020 | kumarb
Hi. We appear to have a basic grip on using the CAD2CAD tool v1.5 from Assembleon for our PCB designs. Can anyone offer advice on how to take our PCB design and allow us to panelize the single PCB to say 2-up or 4-up, etc. So that we can visualize th
Used SMT Equipment | Soldering - Wave
400V 50/60 HZ Version ERSAsoft for: 4.050.000.000 2. Operating System Dell / Windows 7 Processor: Pentium(R) Dual Core E5800 @ 3.20GHz 3.19GHz Memory RAM: 4.00 GB (3.46 GB usable) 320bit Operating System Touch Screen – No Pen Touch, input is availabl
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp
Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Industry News | 2003-03-31 09:24:05.0
AT&S owns 77% of the new company AT&S Klagenfurt Leiterplatten GmbH, with the remaining 23% owned by Klagenfurt Gr�nder- und Innovationspark Besitz GmbH
Parts & Supplies | Visual Inspection
Panasert ai parts 1.Product name:ROLLER 2.Original: China 3.Model No.:X004-075 4.Brand Name:panasert This company specialized production, PANASERT(AJ.AVB.AVF.AVG.AV.AVK.AVK2 RT.JV.J , VK.JVK3.RH.RH3.RH6.RHS .RHS2B .RG131.RL131).UNIVERSAL(
Parts & Supplies | Assembly Accessories
Introduction of kic2000 furnace temperature tester Processing customization: Yes Brand: US KIC Model: kic2000 Measurement range: - 50-1050 (℃) Temperature measurement resolution: 0.1 ℃ Dimension: 320 * 86 * 26 (mm) Packing number: 1 t
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2019-05-29 10:38:59.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
The newly redesigned EasyCoat® 6 software for conformal coating combines several powerful capabilities to deliver a simplified programming experience that reduces programming time, increases throughput and productivity, and achieves high quality coat
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Mon May 10 00:00:00 EDT 2021 - Mon May 10 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Manual Cleaning of Printed Board Assemblies – Step by Step Guide
Events Calendar | Tue Dec 11 00:00:00 EST 2018 - Tue Dec 11 00:00:00 EST 2018 | ,
Inspecting PWB Assemblies for Defects
Career Center | Norcross, Georgia USA | Production,Quality Control
Reports to: Quality Manager Introduction: I Tech e-Services is actively seeking a Quality Control Technician with at least 3 years of experience to join our fast growing team. We are looking for someone who is flexible and willing to learn new skil
Career Center | Moorpark, California USA | Engineering
Responsible for the set up of the SMT line, Wave Solder Machine and actual production. Maintain, program and operate line equipment. Troubleshoot and repair equipment, coordinating with vendors when necessary. Develop standards for stencil app
Career Center | hyd, andhra pradesh India | Engineering,Production,Research and Development,Technical Support
i have a experience in smt and i acan operate europlacer and mydata machines.
Career Center | chennai, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
Two years working in EMS(process and Equipment Engineer)
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/ipc-instructor/ipc-j-std-001-cit/
. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry consensus requirements for electronic products ranging from simple- to high-performance life support systems
