Aeroflex UTMC is a supplier of RadHard Integrated Circuits for Aerospace, Mixed-Signal Commercial ASICs and Distributed Query Processors.
Electronics Forum | Tue Feb 16 14:40:54 EST 1999 | john hearty
Has anyone changed out the old 4400 vision processor on a Fuji IP3 and replaced it with a newer 4800 vision processor. What does it take to do this and what does it consist of doing. What do I need to order from Fuji in order to do this.
Electronics Forum | Thu May 14 05:20:31 EDT 2015 | kielbik
Hi Im looking for a person who have a experience with Intel® Core™ i3-5157U (i5) Processor soldering (CL8064701478404). I want to compare our experience because i'm not sure about aur spare parts and our soldering way. They are original or not, becau
Used SMT Equipment | Soldering - Wave
400V 50/60 HZ Version ERSAsoft for: 4.050.000.000 2. Operating System Dell / Windows 7 Processor: Pentium(R) Dual Core E5800 @ 3.20GHz 3.19GHz Memory RAM: 4.00 GB (3.46 GB usable) 320bit Operating System Touch Screen – No Pen Touch, input is availabl
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Industry News | 2003-02-27 09:01:39.0
U.S. companies are beginning to wake up to the lead-free electronics production movement, which was pioneered in Japan and taken up by European manufacturers.
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Parts & Supplies | Pick and Place/Feeders
HEAD- AND PROCESSOR BOARD HS50
Technical Library | 2010-10-07 20:20:58.0
Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stackin
Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Events Calendar | Wed Feb 15 16:00:00 EST 2017 - Wed Feb 15 16:30:00 EST 2017 | San Diego, California USA
Invited Speaker at APEX 2017 - Embracing a new Paradigm: Electronic Work Instructions
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Career Center | Sunnyvale, California USA | Engineering,Research and Development
- We are seeking candidates at (BS, MS or PhD) levels in Electrical Engineering. - Strong familiarity with Processor / ASIC Architecture - 2-5 years of experience in ASIC Design, Synthesis & Simulation - Solid understanding of ASIC Design Flow - Kno
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Master electrical engineering degree specialized in: Electric circuits and systems Software knowledge: C, C#, C++ Python SystemC VHDL
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ACTIVESEMI&PN=ACT8840QM17A-T
: IC, Advanced PMU for Single-Core Application Processors Physical Description: Quad Flat No-Lead (QFN) with tab, 0.40 mm pitch; square, 12 pin X 12 pin
| https://productronica.com/en/trade-fair/key-topics/sensors-electronics-manufacturing/
. Last but not least, they are becoming increasingly intelligent. Supported by microcontrollers (MCU) and digital signal processors (DSP
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