Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Electronics Forum | Tue Apr 25 22:50:05 EDT 2006 | davef
A toaster oven is an improvement over hand soldering.
Electronics Forum | Tue May 17 16:46:52 EDT 2005 | davef
Most placement machine equipment suppliers offer software for line balancing. What's with Fuji? Fujitrax is a system developed in order to attain high levels of "progress management, quality management & traceability" over several SMT lines, throug
Used SMT Equipment | SMT Equipment
Product name:KD - 770 JUKI chip mounter Product number: KD - 770 if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype
Used SMT Equipment | SMT Equipment
Samsung SM471 mounter Product Name: Samsung SM471 high speed chip mounter Product number: SM471 Detailed product introduction Samsung SM471 high speed chip mounter r parameters High speed Chip machine SM471 is each mount head with 10 shaft an
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Parts & Supplies | Pick and Place/Feeders
SANYO stick feeder GSF-R01 SANYO 5000 Stick Feeder The operation rate of the machine is improved by the ability of stick feeder to operate continuously over an extended period. Unlike traditional stick feeders that rapidly vibrate u
Parts & Supplies | SMT Equipment
Improved wiping strip steel mesh(10100050224） Improved wiping strip steel mesh(10100050224) if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-08-16 18:25:16.0
In one of our Consumer Electronics projects, a leader of networking technologies requested to test dispensing performance of a thermally conductive material, Fujipoly Sarcon SPG-50A. This material improves heat dissipation for higher frequency applications and reduces the negative effects of thermal resistance under heat, cold, humid, and thermal shock conditions. The customer's goal was to dispense a 1mm diameter dot with acceptable speed and consistency.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Wed Mar 13 00:00:00 EDT 2024 - Wed Mar 13 00:00:00 EDT 2024 | ,
Wine Down Wednesday: A Texpat Down Under- The Good, the Quirky, & the Utterly Ridiculous
Events Calendar | Wed Jul 26 00:00:00 EDT 2017 - Wed Jul 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Technical Education - Best Practices in Design
Career Center | Providence, Rhode Island USA | Production
Manufacturing Supervisor for an electronic & electro-mechanical assembly, test, and packaging operation. ISO9001 company. Establish & maintain production schedules, improve efficiency & reduce cycle time, manage & develop staff.
Career Center | Blackwood, New Jersey USA | Production
Responsibilities include the following: Improve the cost effectiveness, efficiency, and quality of production processes. Develop methods, practices, and processes used to manufacture circuit assemblies. Program Surface Mount Equipment for printed ci
Career Center | Dasmarinas, Philippines | Sales/Marketing
an experienced sales and marketing professional with strong background in SMT production process
Career Center | , Honduras | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Several years working as a Mechatronic engineer in the field of automotive industry. I have worked on projects that included new product design and development, manufacturing processes, assembly lines, Continuous Improvement, quality improvement, fac
Imagineering, Inc. | https://www.pcbnet.com/blog/a-guide-to-design-for-manufacturing-dfm-principles/
From Concept to Production: A Guide to Design-for-Manufacturing (DFM) Principles Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances
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. The best way to do this is to first designate a production team to measure performance and understand where improvements are needed
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