Industry Directory | Consultant / Service Provider / Manufacturer
SolderStar produce thermal profiler solutions for reflow soldering, selective solder machine profiling and wave solder optimization.
Industry Directory | Recruiter / Employment Company
We are an East Midlands based recruitment company, we specialise in the electronics industry, working closely with our clients.
The smart profiler for reduced cost, improved quality and convenient data sharing. Built with the Latest Data Processing and Wireless Technologies Available - A Smart Device The SPS Smart Profiler stands out as the best and “smartest” temperature p
Accurately senses component temperatures without soldering or taping! TEMPROBE™ is a patented, precision temperature sensing instrument. The subminiature thermocouple tip can be placed anywhere on a board, including profiling in wet solder paste or
Electronics Forum | Wed Jan 25 07:18:03 EST 2017 | emeto
If you prefer to use same profile - it will be fine most of the time. There are several things to consider. 1. Is there part on second side that cannot withstand temperatures from first side? 2. If there is a high mass component on first side, that
Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby
This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use
Used SMT Equipment | Soldering - Reflow
Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min
Used SMT Equipment | Soldering - Reflow
Still running production unit new unit delivered before the end of the year. The Heller 1809 MK5 is a reflow soldering system used in electronics manufacturing. Here are some key specifications and features: Model: 1809 MK5 Heating Zones: 9 Zones
Industry News | 2003-03-31 09:31:11.0
Electronic contract manufacturers face tough realities
Industry News | 2018-10-18 10:20:21.0
How to get real-time thermal data for a PCB?
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | Air / Vaccuum
Product Name: Hitachi Electric placement vehicle Origin: Shenzhen Material: aluminum profile Product size: 800 * 600 * 1100mm Product Description: 30 Feida can be placed on the second floor / floor Product weight: About 30kg Applicable mo
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys
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Career Center | Coopersburg, Pennsylvania USA | Engineering,Purchasing
Lutron Electronics is the world leader in the design and manufacture of architectural lighting controls and systems. Our company was founded in 1961, with the invention of the world�s first electronic light dimmer. We now have over 18,000 products d
Career Center | Appleton, Wisconsin USA | Sales/Marketing
Are you a highly motivated sales hunter looking for a new opportunity? Are you tired of just being a number within a large organization and want the creativity and support of a small privately owned company? If so, we are looking to expand our sale
Career Center | Wroclaw, Poland | Engineering
Certified IPC Specialist (CIS) IPC-A-610D Honeywell SPOC online training Six Sigma Lean Manufacturing Training Certificate FUJI CP-6 and NXT training: Operating, Maintenance, Programming I can program SMT Fuji machines using Flexa software, maintain
Career Center | Delhi, India | Engineering,Production,Quality Control
Programming, Operation, Maintenance,Troubleshooting of SMT machines. Programming of cyber optics/saki(AOI) Programmingn of pcb seperater Temperature profiling (Making & Soldering) Testing,Troubleshooting of microcontroller based PCAs
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 8, (#ts#)) SMT Express, Volume 2, Issue No. 1 - from SMTnet.com Volume 2, Issue No. 1 Thursday, January 20, 2000
| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/
. The same condition can occur if the PCB itself warps and twist during the soldering process. I would recommend reviewing the thermal profile and the warp and twist characteristics of both the board and the components
| http://etasmt.com/cc?ID=te_news_media,10561&url=_print
. The quality of reflow soldering can be printed, mounted, Reflow soldering is controlled by the process of each process. 2. The longer the length of the heating zone and the greater the number of heating zones, the easier it is to adjust and control the temperature profile
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