Industry Directory | Manufacturer
Datapaq, founded in 1984, is the world leader in temperature profiling. Datapaq systems provide key information on the effectiveness of heat processing in the electronics assembly industry, using the most advanced and tested techniques.
Technical Specifications Memory : 18,000 readings per channel Sampling interval : 0.05 sec to 10 min Accuracy : �0.5�C Resolution : 0.1�C Max internal operating temp : 85�C Data collection : start Start/stop buttons, time or temperature trigger B
The instrument can be applied for control of the radiation profile in UV-dryer channels. The integrated sensor is available for different spectral ranges (UVA, UVB, UVC). Due to the flat housing the measuring device can be directly applied in the dry
Electronics Forum | Wed Apr 19 11:54:32 EDT 2000 | Rudolf Niebling
You need a KIC profiler whitch is able to find optimal profiles for your boards. The KIC works very well with the Heller ovens. With the KIC is also possible to find one good profile for different boards. Get in contact with KIC +1-858-673-6050
Electronics Forum | Mon Apr 17 19:54:39 EDT 2000 | Dave F
Sounds like a true IR guy to me!!! Your profile should reflow solder on the board properly to produce a reliable product for your customer. If that requires more than one proifile, so be it!!!. That being said, we went from hundreds of IR profiles
Used SMT Equipment | Soldering - Reflow
hh 5 independent controlled heating zones hh Internal cooling zone hh Integrated Ioniser for ESD safe soldering hh DIMAsoft reflow profiler software available hh Flux traps to minimize contamination of the system hh Easy to service one way appro
Used SMT Equipment | Soldering - Reflow
hh 5 independent controlled heating zones hh Internal cooling zone hh Integrated Ioniser for ESD safe soldering hh DIMAsoft reflow profiler software available hh Flux traps to minimize contamination of the system hh Easy to service one way appro
Industry News | 2009-04-15 23:01:13.0
BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2008-02-28 14:52:50.0
January 2008 � The Datapaq Surveyor will be showcased at the 2008 IPC/APEX tradeshow in booth #1438. The Surveyor provides and easy and accurate way to monitor the thermal performance of your reflow oven every hour, day and shift - effortlessly.
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Automation for Tracker Model 30, TrackerPXI and more A Huntron Access Prober is used to automate the testing of printed circuits assemblies (PCA) that would otherwise have to be tested by hand. Adding Flying Probe technology your test procedure wil
This video is for the PDR IR-C3 Chipmate 2000 Rework system/station - Operational Video. It gives you an overview and shows you the basics of how to operate your PDR IR-C3 Rework system. www.pdr-rework.com
Career Center | Appleton, Wisconsin USA | Production,Quality Control
Job Responsibilities: Surface Mount Technology Corporation is seeking an experienced Process/Equipment Technician adept at the skills necessary to lead the continuous improvement process as related to machine performance and development efforts in p
Career Center | Appleton, Wisconsin USA | Production,Technical Support
Surface Mount Technology Corporation is seeking an experienced Process/Equipment Technician adept at the skills necessary to lead the continuous improvement process as related to machine performance and development efforts in preventative maintenance
Career Center | Springdale, Arkansas USA | Production,Research and Development
solder, electronic assembly, pcb repair, wave solder, smt, solder pot, testing unit,dexterity, program IC's,the rest in resume
Career Center | , | Engineering,Sales/Marketing,Technical Support
Applications Engineer with over 20 years of combined Manufacturing/Field Service/Applications Engineering experience in the SMT industry.
SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass
SMTnet Express, March 7, 2019, Subscribers: 31,716, Companies: 10,725, Users: 25,814 Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints Credits: DfR Solutions Electronic assemblies use a
| http://www.thebranfordgroup.com/dnn3/Auctions/PastSales/tabid/58/Default.aspx
& Health Products Manufacturer Late Model Lab Equipment - Numerous UPLC & HPLC's Instruments by Agilent, Waters Acquity, Thermo Scientific Flammable Cabinets, Large Qty of Consumables & More
winsouce.jpg)