Industry Directory | Consultant / Service Provider
PCB design over net
Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
New Equipment | Education/Training
IPC J-STD 001 REV F Requirements for Soldered Electrical and Electronic Assemblies. The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released August 2014. IPC J-STD-001
1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL 8).
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Fri Jan 29 10:09:27 EST 1999 | Robert Cass
Would anyone have experience or information on where I could find pad geometry for tantalum capacitors that can be surface or plated thru hole mounted.
Used SMT Equipment | Screen Printers
Momentum is designed to provide efficiency and speed. With its triple track conveyor rails and servo drive motors, for example, the Momentum Elite model orders the highest performance capacity in the series, making it the ideal printer for high volum
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Industry News | 2019-03-03 18:51:58.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor this Chapter Tutorial Program on March 28 featuring presentations by Yaad Eliya and Jim Barry of PCB Technologies.
Parts & Supplies | Pick and Place/Feeders
FUJI NXT H01 SMT Nozzle 7.0 AA08000 Original New For FUJI SMT Machine Brand Name NXT Model Number AA08000 Place of Origin Japan Minimum Order Quantity 1pcs Payment Terms T/T, Western Union, MoneyGram,Paypal Supply Ability 1000pcs Delivery Tim
Parts & Supplies | Circuit Board Assembly Products
PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic
Technical Library | 2019-12-26 19:13:52.0
Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.
Technical Library | 2020-07-22 19:39:05.0
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a plating wrap failure is unpredictable. The purpose of this study was to quantify the effects of various copper wrap plating thicknesses through IST testing followed by micro sectioning to determine the failure mechanism and identify the minimum copper wrap thickness required for a reliable PWB. Minimum copper wrap plating thickness has become an even a bigger concern since designers started designing HDI products with buried vias, microvias and through filled vias all in one design. PWBs go through multiple plating cycles requiring planarization after each plating cycle to keep the surface copper to a manageable thickness for etching. The companies started a project to study the relationship between Copper wrap plating thickness and via reliability. The project had two phases. This paper will present findings from both Phase 1 and Phase 2.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Career Center | Tampa, Florida USA | Engineering,Production,Quality Control
Bachelors degree in EE or IEKnowledge of manufacturing processes including SMT and through-hole technologyAble to read and interpret military and commercial contracts and print packages and generate inspection instructionsThorough knowledge of applie
Career Center | Santa Clara, California USA | Engineering
Job Description: � Manage and perform preventative maintenance activities of equipment � Tooling order and management for production � Maintain efficient record keeping of PM records and calibration � Able to perform new equipment buy-off, set up
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
SMTnet Express, December 27, 2019, Subscribers: 33,251, Companies: 10,949, Users: 25,451 A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism Credits: Beihang University PTH plays a critical role in PCB reliability. Thermal
ORION Industries | http://orionindustries.com/pdfs/silpadk10.pdf
Gap Pad? 1500 Sil-Pad®K-10 The High Performance Kapton™ Based Insulator The Bergquist Company The Bergquist Company-Europe The Bergquist Company-Asia North American Headquarterss Bramenberg 9a 9F-1, No
KingFei SMT Tech | https://www.smtspare-parts.com/sale-14324537-mc14-000068-pad-vacuum-pfg-3-5a-rubber-pad-samsung-sm-nozzle.html
MC14-000068 Pad Vacuum -PFG-3.5A Rubber Pad Samsung Sm Nozzle Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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