Industry Directory | Equipment Dealer / Broker / Auctions
Buyer, Seller, Broker of Electronic Assembly Equipment
Industry Directory | Equipment Dealer / Broker / Auctions
CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces the new ezLOAD PCB Support System. With the recent increase of densely populated double-sided circuit boards, COT recognized the need for more affordable
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef
First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i
Electronics Forum | Wed Jan 07 07:16:25 EST 2004 | davef
Cold solder prior to properly performing a well designed drop test. Actually, "cold solder" means different things to different people. Two dull solder connection conditions are: * "Disturbed" solder joint: a solder joint that has an "angular face
Used SMT Equipment | SMT Equipment
Product name: KE – 3010ACL high-speed chip mounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic: Constantly improve the KE series products. So as to realize the high speed high quality electric production line of f
Used SMT Equipment | AOI / Automated Optical Inspection
High-Speed High-Precision Hybrid AOI (YSi-12) Specifications Model YSi-12(Model:KKH-000) Applicable PCB L600 x W460mm~L50 x W50mm※An optional case, L780×W460mm~L50×W50mm Visible rays Visible ray/infrared ray:19μm (Pos
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | Assembly Accessories
TEST PCB LP3 ..00359534-01 Tester PEL-2002A Push pull tester NK-500 Neon lamp tester SX-C Test Probes (Universal Probe) TL20 Probes Connector Test Point temp (Male) SMPW-K-M. DIP TESTER DS-10
Parts & Supplies | Assembly Accessories
TEST PCB LP3 ..00359534-01 Tester PEL-2002A Push pull tester NK-500 Neon lamp tester SX-C Test Probes (Universal Probe) TL20 Probes Connector Test Point temp (Male) SMPW-K-M. DIP TESTER DS-10
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2015-08-13 15:52:40.0
Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.
Unsurpassed cleaning, high-efficiency drying, low cost of ownership, ease of maintenance, and minimum downtime all come together in the ELECTROVERT Aquastorm, a world-class printed circuit board cleaning system. As high-reliability PCBs become minia
PCB Mis Print Cleaning Machine ETA-2100 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning Machin
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Fremont, California USA | Production,Quality Control
Local industry leading EMS Company seeking SMT operators. Will be doing SMT line Change overs, SMT machine operation for solder printing, placement, reflow. Solder paste height measurement and record. Solder printing quality check after solder paste
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
Career Center | north augusta, South Carolina USA | Production,Quality Control
I am a skilled smt operator that pays close attention to detail! With my experience in the electronic field for the passed 10 years proving to be an asset to all companies that i have worked for in providing quality work and ensuring on time delivery
SMTnet Express, May 9, 2019, Subscribers: 31,902, Companies: 10,760, Users: 26,083 Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material Credits: iNEMI (International Electronics
Featured Article Return to Front Page REFLOW SOLDERING
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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