Rental and sele of communications, fiber optic and general purpose test equipment.
Industry Directory | Consultant / Service Provider
This informations has been added for testing purposes. Info are not valid
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
Hanwha XM520 Pick and Place Machine Hanwha XM520 Chip mounterPatch speed: 100,000 CPH(Optimum)size:1430x1900x1994mmProduct description: The Hanwha XM520 Pick and Place Machine, a general purpose chip mounter with the best-in-class productivity and
Electronics Forum | Tue Apr 08 09:56:58 EDT 2008 | slthomas
Is it a factory (Universal, Panasonic, etc.) holder or aftermarket? We used to use Fancort holders on our Universals and they're definitely still around.
Electronics Forum | Tue Apr 08 04:40:43 EDT 2008 | fnorradd
Hi, just wonder if anyone has any recommendations of where i can find spare parts for the adjustable PCB workboard holders ie, clamps, support arms and spring loaded supports etc. Basically looking for everything apart from main plate. Any details
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2003-05-29 08:40:51.0
Withdrawal of Nam Tai's registration statement filed on Form F-3 for a proposed offering of 3,000,000 common shares of the company
Parts & Supplies | General Purpose Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. /8" Mirror He
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2007-02-01 09:36:26.0
Purpose: Compare the Surface Insulation Resistance of reworked BGA Test samples made with standard solder balls using a flux only reattachment and samples made including the StencilQuik™ product from Best Inc. with solder balls using a flux only reattachment.
Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. The Nordson YESTECH FX-940U
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Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Events Calendar | Tue Oct 15 00:00:00 EDT 2024 - Thu Oct 17 00:00:00 EDT 2024 | ,
GfKOOR Series | Seminar Application and Utilisation of Protective Coatings for Electronic Assemblies
Events Calendar | Wed Sep 11 00:00:00 EDT 2024 - Wed Sep 11 00:00:00 EDT 2024 | San Diego, California USA
San Diego Chapter In-Person Event: Reclaiming Precious Metal from SMT Scrap
Career Center | Orlando, Florida USA | Engineering,Maintenance,Production
***Position Available Immediately*** Amber Diagnostics looking for a steady, flexible, hardworking, problem solver with multiple skills to work at our refurbishing facility in Orlando, FL. We buy, sell and refurbish radiology medical equipment su
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, d
Career Center | vapi,gujrat, India | Engineering
analog and digital electronics circuit,VLSI,microprocessor and microcontroller,semiconductor,wireless communication.
Career Center | Port Harcourt, Argentina | Management
Hold strong background in electronic repairs
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic3139&OB=ASC.html
Purpose of No Probe Top and DFA Top - PCB Libraries Forum Forum Home > Training / Events > PCB Design Basics New Posts FAQ Search Events Register Login Purpose of No Probe Top and DFA Top
KingFei SMT Tech | https://www.smtspare-parts.com/sale-11739055-multi-purpose-mounter-surface-mount-placement-machine-xpf-l-w-original-fuji.html
Multi - Purpose Mounter Surface Mount Placement Machine XPF-L/W Original FUJI Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
