Industry Directory | Distributor / Manufacturer
Equip-Test with Global Headquarter in Budapest Metropolitan Area, Europe is a global player in manufacturing PCB test equipment.
Industry Directory | Manufacturer
XYZTEC is the market and technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester, providing leading customers with fully automated shear, push and pull testing.
JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
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Automatic splicing machine BMHP-08 BMHP-24 It replaces manual labor to splicing,suitable for8-24mm splicing Tape it has the function of Barcode comparison,detectsempty pockets of the component reels,Font&charactersprinting comparison,Systems inter
Electronics Forum | Sun Jul 29 21:23:27 EDT 2001 | nifhail
When carry out the contamination test,do we measure for Chlorides on water soluble and No-clean fluxes? 1) What is the equivalent factor for machines developed to test the board cleanliness, Omega-meter vs Ionograph vs Zero-ion. 2) What values do we
Electronics Forum | Mon Sep 11 04:23:49 EDT 2000 | Wolfgang Busko
Adam: I would say that you do have a reliability problem. - check parts for solderability - check your board finish - check your profiles - check your paste - check your processes with focus on cleanliness - do some mechanical tests, you should rath
Used SMT Equipment | SMT Equipment
1 Component size: 0603 chip - X W24mm L24mm Mount beat: 0.42s/QFP Placement accuracy: + - 30 um/ QFP Component size: 0603 chip - X W90mm L100mm if need more info about the products , pls don’t hesitate to contact with us at any t
Used SMT Equipment | SMT Equipment
Product name: JX - 300 led high-speed chip mounter Product number: JX - 300 led Products in detail The most suitable for LED lighting, large LCD back light in a machine or production of the LED placement machine was born Chip components 27100
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Industry News | 2003-06-25 12:40:26.0
to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks
Parts & Supplies | SMT Equipment
JUKI 103 0603 Model: JUKI 103 0603 Nozzle JUKI Nozzle List Brand Machine model Specification Material of nozzle tip JUKI JUKI 750 / 760 101 / 102 / 103 / 104 / 105 / 106 Tungsten steel JUKI JUKI 750 / 760 201 / 202 / 203 / 204 Tungsten steel
Parts & Supplies | SMT Equipment
PUSH UP BELT if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 008
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
FUJI M6 III High Speed Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place ma
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Career Center | bangalore, India | Management
• Hands on experience in planning functions i.e. material planning, scheduling, inventory management. • We have a good knowledge of BOM, KANBAN, MIN-MAX order quantity, • We have Good knowledge in ERP Baan System , • Demand adjustment as per cu
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/0603-chip-minimum-land-pattern_topic1559_post6333.html
0603 Chip Minimum Land Pattern - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login 0603 Chip Minimum Land Pattern
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=46
Test and Inspection X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
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