We are a manufacturer of all forms of electro-mechanical switches including rockers, toggles, push buttons and pressurre switches.
Industry Directory | Manufacturer
MISNO was founded in 1961 from China and Taiwan, specializes in development, production and supply of high quality push pull Solenoid and Electromagnet to the worldwide clients, also constantly committed to product innovation.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Used SMT Equipment | SMD Placement Machines
* DOS * Flying Nozzle change * Fiducial camera * Pneumatic tape feeder * Locate Pin * Edge clamp * Z servo push plate * Entrance sub stop * Exit sub stop * Auto width adjust * Feeder float detection
Used SMT Equipment | SMD Placement Machines
* Windows NT * Super fine head * Line Array camera * Pneumatic Tape Feeder * Locate pin * Edge Clamp System * Z servo push up plate * Entrance sub stopper * Exit sub stopper * Auto width adjust * Hi
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2009-01-21 23:01:49.0
Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 13 18:30:00 UTC 2024 - Thu Feb 15 18:30:00 UTC 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Events Calendar | Mon Feb 14 18:30:00 UTC 2022 - Wed Feb 16 18:30:00 UTC 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Career Center | Buffalo, New York USA | Engineering
This opportunity offers growth & visibility within the organization! You'll be challenged and asked to push the limits… flex/rigid boards, multi layer, mixed technologies (RF, power, digital) etc... • Design VERY complex, h
Career Center | Rockledge, Florida USA | Engineering,Production,Quality Control
Are you an engineer with SMT experience, and in the Rockledge, FL area? If so, our client has a SMT Process Engineer position available that may be your next great opportunity! The Surface Mount Technology (SMT) Process Engineer will take the lead
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support
A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te
Career Center | Palghat, Kerala India | Management,Production
SUMMARY Two years of experience in telecommunication industry dedicated in manufacturing Electronic Push Button Telephones and Six months of experience in surgical industry dedicated in manufacturing Surgical Absorbent Cotton Wool. Presently wo
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic832&OB=ASC.html
: 5380 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 31 Jan 2013 at 9:15am It's been pushed over to programming
KingFei SMT Tech | https://www.smtspare-parts.com/sale-40883567-rc-100m-n-printing-machine-1m-cache-conveyor.html
.Use in SMT production line, setting up behind AOl and SPlAccording to the NG and Ok signals given by the detectionequipment, the NG PCB will be pushed up and the OK PCB issent to the next equipment; 2
