94 qfn, half-etch results

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN

International Conference for Electronics Hardware Enabling Technologies

Surface Mount Technology Association (SMTA) | https://www.smta.org/icehet/workshops.cfm

field experience with scientific research to solve everyday problems. These half-day courses are led by internationally respected professionals with extensive experience in the subject area

Surface Mount Technology Association (SMTA)

Tape & Label Production Equipment | Nordson

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/tape-and-label?con=t&page=35

3 Nordson DAGE High quality X-ray inspection for production applications. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking

ASYMTEK Products | Nordson Electronics Solutions