Electronics Forum | Fri Jan 18 14:39:07 EST 2013 | davef
Main issues with LGA voiding are: * Design * Material selection * Thermal recipe For design, loo here http://blogs.smtnet.com/smt/other/qfn-btc-design-guidelines-thermal-pads-etc/ BR, davef
Electronics Forum | Fri May 17 14:56:21 EDT 2013 | davef
There's not supposed to be any effin 'drain hole.' Where's you get that from? Read this: http://blogs.smtnet.com/smt/other/qfn-btc-design-guidelines-thermal-pads-etc/ BR davef
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