New Equipment | Rework & Repair Equipment
Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles. The goal of lead restoration is not to mimic "l
Electronics Forum | Wed Mar 10 08:20:00 EST 2010 | aajmera
I am sorry, they are fine-pitch QFPs (20 mils)
Electronics Forum | Tue Sep 30 20:05:34 EDT 2003 | afm
Does alloy 42 lead frame on a QFP100 make lack of coplanarity (let's say 2 mils), a critical factor to have non-wetted leads? Lead coating is tin lead 90/10. afm
Industry News | 2017-11-09 14:55:51.0
BPM Microsystems is demonstrating its new 4900 automated programming system at Productronica. The 4900, with its advanced chip-scale part (CSP) device handling, on-the-fly vision alignment, and HS400 programming speeds, satisfies a vast range of programming needs in one automated system. Featuring high-performance laser marking and 3D inspection, the 4900 provides advanced serialization and quality control, meeting the highest programming and cyber security standards for automotive, aerospace, medical, industrial and mobile device industries.
Industry News | 2007-10-26 13:08:43.0
MORRISVILLE, NC - October 24, 2007 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the KE-2060RL High-speed Fine-pitch Assembler with IFS-X2 in booth 615 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center.
JUKI FX-1 E2155725000 AWC BELT (M L) E21517150A0 FRONT RAIL S ASM. E2151723000 RUBBER RING E2151725000 AWC BRACKET F E2151802000 STOPPER BRACKET RA E21527150A0 REAR RAIL S ASM. E2152721000 DRIVE SHAFT C E21527230B0 PAD BLOCK ASM E2152729AA0
Parts & Supplies | Component Packaging
L140E321000 Y CABLE BEAR FX-1R JUKI Smt Pcb Assembly Equipment JUKI E2047700000 CT BELT F JUKI E2047721000 DRIVE PULLEY F JUKI E2047725000 RAIL PLATE FL JUKI E2048700000 CT BELT R JUKI E2048721000 DRIVE PULLEY R JUKI E2048725000 RAIL PLATE F
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
Panasonic NPM-D3 Modular SMT Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, P
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11739055-multi-purpose-mounter-surface-mount-placement-machine-xpf-l-w-original-fuji.html
≥1.33 - Dispense position accuracy: +/-0.1 mm cpk≥1.00 QFP parts +/-0.040 mm cpk≥1.00 +/-0.053 mm cpk≥1.33 +/-0.030 mm cpk≥1.00 +/-0.040 mm cpk≥1.33 +/-0.040 mm cpk≥1.00 +/-0.053 mm cpk≥1.33 PCB size (LXW) Up to 457 x 356 mm Thickness