Industry Directory | Manufacturer's Representative
MiniATE Systems represents world class manufacturers of high quality IC Sockets & Connectors for Test & Burn-in, Development and Electronic Production.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of
New Equipment | Education/Training
BEST SMT training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature 0.062in thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This SMT tra
Electronics Forum | Fri Apr 09 15:41:11 EDT 1999 | Matt Stackhouse
| DOES ANY ONE KNOW HOW I CAN STRAIGHTEN | BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING | THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM. Here is a neat trick if you have the equipment. If your company does any feature measurement of mechanical de
Electronics Forum | Wed Dec 24 22:46:58 EST 1997 | Scott McKee
| Can anybody give me feed back on the pro and cons of | using Pace, OK, Hakko, Metcal, etc... equipment in | their rework processes? I need to set up a low volume | rework station for mixed technology boards. | Would appreciate any suggestions. I
Used SMT Equipment | SMT Equipment
Product Name: Panasoinc chip mounter CM88S-3 Product number: CM88S-3 Detailed product introduction High speed chip CM88C-M Panasonic Machine model: CM88C/S Machine year: 1999-2002 PCB size: Min:50*50 Max:330*250 Patch speed: 0.085 seconds /CH
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter CM88C-M Product number: CM88C-M Detailed product introduction High speed chip CM88C-M Panasonic Machine model: CM88C/S Machine year: 1999-2002 PCB size: Min:50*50 Max:330*250 Patch speed: 0.085
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Parts & Supplies | Pick and Place/Feeders
Name of equipment: Samsung SM421, Samsung SM421 mounter, used Samsung SM421 mounter The latest arrival of Samsung SM421 mounter 18, 12-year machine, color state is excellent, welcome to buy! ! ! Brief introduction of equipment Samsung SM421
Parts & Supplies | Pick and Place/Feeders
Hanwha SM471 Plus Pick And Place Machine Features: Fast Electric Feeders which automatically adjust their pocket positions for ultimate synchronised picking Front and back operation as standard Large PCB Size of 510mm x 460mm as standard with o
Technical Library | 2023-11-25 07:46:13.0
In the dynamic realm of Surface Mount Technology (SMT), where efficiency and precision are paramount, I.C.T, a renowned SMT equipment manufacturer, proudly unveils its latest innovation – the I.C.T-910 Automatic IC Programming System. Crafted to cater to the intricate demands of SMD chip programming, this cutting-edge device vows to redefine your programming experience and elevate production capabilities. Programming system.png The Power of IC Programming System: As a beacon of excellence in IC Programming Systems, the I.C.T-910 seamlessly integrates advanced technology with user-friendly features. This system empowers manufacturers in the SMT industry, offering versatility in programming needs by accommodating a wide range of SMD chips. Precision Programming: The I.C.T-910 boasts unparalleled precision in programming SMD chips, ensuring accuracy in every generated code. In the SMT industry, where even the slightest error can lead to setbacks, this precision is indispensable. Efficiency Redefined: Accelerate your production timelines with the I.C.T-910's efficient programming capabilities. Engineered to optimize workflows, this system ensures rapid programming without compromising quality, recognizing that time is money in the SMT industry. User-Friendly Interface: Navigating the complexities of IC programming is simplified with the I.C.T-910's intuitive user interface. Operators, even without extensive programming expertise, can harness the system's power, minimizing the learning curve and maximizing productivity. Compatibility and Adaptability: The I.C.T-910 breaks free from limitations, supporting a wide array of SMD chip models. It is a versatile solution for diverse programming requirements, allowing you to stay ahead of technological advancements. Why Choose I.C.T-910 IC Programming System? 8 sets of 32-64sit burners Nozzle: 4pcs Camera: 2pcs (Component camera + Marking camera) UPH: 2000-3000PCS/H Package type: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP, and so on. Compatibility: Adapters provided based on customer products. Simple operation interface: Modular and layered interface with pictures and texts for easy operation. System upgrade: Free software upgrade service. Reliability: Trust in the I.C.T-910, a programming system that prioritizes reliability. Rigorous testing ensures consistent and dependable performance, reducing the risk of programming errors and downtime. Elevate Your Competitiveness: Incorporate the I.C.T-910 into your production line to elevate competitiveness in the market. Stay ahead with a programming system designed to meet the demands of the fast-paced SMT industry. Embrace the Future with I.C.T-910: In a landscape where precision, efficiency, and adaptability are non-negotiable, the I.C.T-910 Automatic IC Programming System emerges as the game-changer for SMT manufacturers. Revolutionize your programming processes, enhance productivity, and future-proof your operations with the I.C.T-910. Choose I.C.T-910 and stay ahead in the SMT industry, ushering in the next era of IC programming excellence.
Panasonic CM602-L high-speed module placement machine, CM602-L placement machine not only follows the original module of Panasonic CM402, but also adds 12 nozzle high-speed head and direct suction tray as needed. The function of the original 8 nozzle
Model name CM602-L Model NM-EJM8A Substrate size L 50 mm × W 50 mm ～ L 510 mm × W 460 mm High-speed placement head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip) Mounting accuracy ±40 μm/chip (Cpk ≧1) www.smt11.cn Co
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page << Back to Page 2 Page 4 >> Cm System Measurement Principle Measurement instability
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/advanced-features/time-domain-imaging
● AW Series Custom Systems Advanced Features Special Values Industry Applications Microelectronics Power and Energy Automotive Military and Aerospace MEMS, Wafers and Seals Materials and Composites
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-pcb-advantages-and-applications/
. This type of PCB technology allows for improved functionality in smaller consumer products, denser BGA and QFP packages, and lowered heat transfer induced stress
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