Electronics Forum | Wed Jun 03 13:56:09 EDT 2009 | mika
less total area of voids, which mean a much more strength in the joint and much easier to solder such a cooling pad grounded via vias, with this approach! The same goes for big cooling pads of let say Power transistors without any via etc. Always re
Electronics Forum | Thu Jun 17 19:40:11 EDT 1999 | Scott Cook
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
• Remove Needle/Nozzle Support section - relocated to separate document PN 22200609. • Add additional images of calibration station. 03/03/2015 2.8 New • Add specifications: Volts AC note, 2-pole 3 wire ground note, power cable wire gauge specs
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
# of PCB layers, larger internal connections, thicker Cu ground layers and poor Cu balance that in some cases cannot be fix by designers difficult current soldering processes narrowing process window
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