Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
Industry Directory | Consultant / Service Provider / Manufacturer
EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
The 907 micro Placer series allows you to place and rework BGA, mBGA, QFP, and Flip-Chip devices quickly and accurately. This unit is quick and accurate for placing devices with the added option of built in rework. You can place and reflow devices w
Electronics Forum | Thu Apr 15 16:07:37 EDT 2004 | barry
Hi there all, we are having problems with 2 qfp devices. grainy poorly reflowed solder joints. One 100 pin .5mm pitch, and one 64 pin .5 mm pitch . Both of these devices have a thermo pad on the back of them (pad area soldered to back of device)which
Electronics Forum | Thu Apr 22 12:27:47 EDT 2004 | barry
I placed thermo's at 2 of the problem devices. Soak (time 150 to 180) 100 sec. Time above 180 =80 secs with 208 deg. peak. The solder appeared to flow at these pads, but little to no adhesion to the joint.Total time in oven was 5 min. All other joint
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine TP400V is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0603、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine 210 is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0402、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision pos
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Parts & Supplies | SMT Equipment
PANASONIC MPAG3 SMT NOZZLE Supply original new and copy new nozzles for MPAG3 machine Part Number (OEM) Description MPAG3 NZ. (1.7 X 1.2) MPAG3 NZ. (1.7 X 1.5) 109700860-02 MPAG3 NZ. M (16 X 2.1 MPAG3 NZ. (4.0 X 3.4) 104593840 MPAG3 NZ.
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Parts & Supplies | Assembly Accessories
Panasonic MPA Nozzle Part Number Description Panasonic MPA Nozzle 1015679101 CENTRALING CHUCK - S (3 HOLES) Panasonic MPA Nozzle 1015679201 CENTRALING CHUCK - M (SINGLE HOLE) Panasonic MPA Nozzle 1015689214 CENTRALING CHUCK - L ** Panaso
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
| https://zksale.en.ecplaza.net/offers/panasonic-cm602-nozzle_8936318
) Nozzle for 1608/2012 - Type 115 16) Dia 6 mm pad (large) nozzle - Type 450 (SOP, QFP, PLCC, 18 x 18 mm) Dia 6 mm pad (large) nozzle - Type 460 ..... More products from this seller See more Send your message to this supplier To Mia
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-pcb-advantages-and-applications/
. This type of PCB technology allows for improved functionality in smaller consumer products, denser BGA and QFP packages, and lowered heat transfer induced stress
