Industry Directory | Distributor
Toshi Technology Inc. is a specialist in buying and selling, both Nationally and International, used Circuits Assembly Equipment and Automatic Test Equipment. (Fuji, Panasonic, Universal, etc)
Industry Directory | Distributor / Manufacturer
An international distributor of mechanical IC samples or "dummy" components, SMD production tools and equipment
Yamaha YC8 Chip Shooter Compact Modular Odd Form Placement ❙ Features of Yamaha SMT YC8 Odd Form Placement Yamaha compact modular PCB chip shooter, Yamaha SMT chip shooter machine, applicable PCB size, L50 x W50mm to L330 x W360mm, YC8 Odd For
Panasonic NPM-D3 Modular SMT Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, P
Electronics Forum | Thu Apr 15 16:07:37 EDT 2004 | barry
Hi there all, we are having problems with 2 qfp devices. grainy poorly reflowed solder joints. One 100 pin .5mm pitch, and one 64 pin .5 mm pitch . Both of these devices have a thermo pad on the back of them (pad area soldered to back of device)which
Electronics Forum | Fri Apr 23 12:47:29 EDT 2004 | barry
I have increased my peak to 220, and Flow is better, but it still not quite a good fillet all around. The solder tends to kinda "bunchup" at the toe of the lead. If part is Pb free, would this affect adhesion and or flow?
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Industry News | 2023-03-16 14:31:59.0
The SMTA is pleased to announce the Best Papers from SMTA International 2022. The winners were selected by members of the conference technical committee. For these exceptional achievements, a plaque is given to primary authors of all winning papers.
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: Glue Dispenser Nozzle Part Number: KV6-M711A-0XX Model: 0603 Component: 1608mm Material: Metal Machine Model: YV64D YV64D glue dispenser nozzle 0603 KV6-M711A-0XX SHOT 1608(P0.8) NOZZLE 2 SHOT1608(P0.8) 1 T
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: Glue Dispenser Nozzle Part Number: KV6-M711A-0XX Model: 0603 Component: 1608mm Material: Metal Machine Model: YV64D YV64D glue dispenser nozzle 0603 KV6-M711A-0XX SHOT 1608(P0.8) NOZZLE 2 SHOT1608(P0.8) 1 T
Technical Library | 2014-10-16 16:39:12.0
Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
Yamaha YC8 Chip Shooter Compact Modular Odd Form Placement ❙ Features of Yamaha SMT YC8 Odd Form Placement Yamaha compact modular PCB chip shooter, Yamaha SMT chip shooter machine, applicable PCB size, L50 x W50mm to L330 x W360mm, YC8 Odd For
Panasonic NPM-D3 Modular SMT Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, P
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.
The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.
Career Center | Middleboro, Massachusetts USA | Production
Highly motivated SMT Repair/ Assembly Operators needed for Contract Electronics Manufacturer. Duties include: repair and soldering of SMT and TH components, assembling of PCB's, and operation of automated production equipment. Experience using vario
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
Career Center | INDIA, India | Engineering,Quality Control
BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.
. During QFP analysis, for example, the rotational acc
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts. During QFP analysis, for example, the rotational accuracy can
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2167.html
Land Patterns For Lead-Free Componet Soldering - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login Land Patterns For Lead-Free Componet Soldering
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