New Equipment | Cable & Wire Harness Equipment
Compact, Stand-Alone Pulse-Heat Pulse Heat System The SMR features a Pulse Heat power output which provides controlled temperature ramp-up to reflow temperatures, reducing thermal shock risk and unwanted heating of adjacent solder joints. The syste
High-speed Automated X-ray CT Inspection System The Omron VT-X750 is the perfect solution to manufacturers desiring the highest-speed, in-line, automated 3DCT X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joi
Electronics Forum | Tue Feb 11 04:08:51 EST 2020 | majdi4
we have a problem : The connector is falling down in the second reflow. This connector is mounted in the first side. You can find attached the reflow profil we work with and a photo of the connector. We tryed with under_film but the connector is sti
Electronics Forum | Wed Feb 12 19:06:28 EST 2020 | SMTA-Alex
I see that the connector has plastic alignment pins. Is there any reason you can squirt a drop hi-temp "Crazy" glue into each hole, after the bottom side assembly and before printing the top side?
Used SMT Equipment | Pick and Place/Feeders
Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mmcomponents, the wide range of special-shaped long joint element The height of the object elementcorresponds to 25.5 mm 10 ~ 30 n can be easy to stick
Used SMT Equipment | SMT Equipment
Product name: YS88 multi-function module chip mounter Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mm components, the wide range of special-shaped long joint element The height of the object elem
Industry News | 2011-12-01 14:01:34.0
Ersa has expanded its product range by the ECOSELECT 1: a selective soldering machine requiring less than 3 m² of space - thus fitting optimally into cell production environments.
Industry News | 2012-03-28 21:08:39.0
Manncorp's new "Production Runner" turnkey PCB production line is designed to meet the needs of high-mix, low-to-mid-volume automated assembly and is equally suitable for both short and long runs. The line includes Manncorp’s acclaimed dual-head 8,000 cph MC-385V2V pick and place, the 5500 dual squeegee stencil printer and the CR-4000C lead-free hot air convection reflow system.
Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
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Parts & Supplies | AOI / Automated Optical Inspection
KHY-M221A-A0 COVER DUCT ASSY for YAMAHA YG and YS SMT placement equipment YAMAHA KHY-M221A-A0 COVER,DUCT ASSY. YG12 YS12 KHY-M7AC0-00 SCAN CAM. ASSY KKD-M78C0-00 SCAN CAM. ASSY KHY-M7AC0-000 SCAN CAM. ASSY YG12/YS12 KKD-M78C0-000 SCAN CAM.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
The LPKF ZelFlex Z4P is a pneumatic 4-sided high-speed clamping frame for stencils. More information: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/quick-release-frames/zelflex-z4p.htm?utm_source=youtube&utm_medium=social&utm_term=s
ORPRO Vision AOI Presentation. This presentation introduces the methods and technology used by ORPRO Vision in the Symbion S36 Plus and Vantage S22 Plus AOI systems. For additional information, please contact ORPRO Vision at sales.us@orprovision.co
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/questions-answers_forum34&SO=UR&OB=asc_page8.html
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Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. For instance, what is the impact of reworking a SAC305/405 assembled connector using an alternate Pb-free alloy? Is changing the Pb-free alloy used within the primary attach process to match the PTH rework alloy the right solution
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