Selling circuit cards and components for older Quad and MPM and Speedline machinery
New Equipment | Design Services
8m long distance UHF bluetooth card handheld android rfid 915mhz RFID Reader please contact me when you get a chance: skype: andyzhou60 email: andy@vanch.net whatsapp:+8613477040905 wechat:H027345 Product Features: Android 4.0/Win CE 6
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Electronics Forum | Thu May 20 10:01:23 EDT 2010 | jmw
Just a slight correction....the quad align card is located at the back rear right of the machine (in a cage). If it is a cyber-optics 4c machine....the laser align card is in the front card rack to the far left.
Electronics Forum | Thu May 20 09:47:25 EDT 2010 | pforister
Is this a single head Quad IVc or a dual headed line? if it is a dual line you can swap the align cards in the front bay between the two heads and see if the symptom follows. The card on the far right is a transport card, shouldn't need to swap tha
Used SMT Equipment | Pick and Place/Feeders
Samsung / Quad Corp Quad QSA-30 SMT Pick& Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: C80006 Features: 3 Nozzle Head 1 Gantry Quad align on the fly heads 208V Power Requirement
Used SMT Equipment | Pick and Place/Feeders
Samsung / Quad Corp Quad QSA-30A SMT Pick & Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: C80122 Features: 3 Nozzle Head 1 Gantry Quad align on the fly heads 208V Power Requirement
Industry News | 2011-03-11 14:17:49.0
Count On Tools Inc. will introduce its latest developments in SMT nozzles and consumables in Booth #1965 at the upcoming at the upcoming IPC APEX conference and exhibition, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2013-08-01 12:59:51.0
Count On Tools (COT) Inc has launched its interactive online catalog and redesigned Web site.
Parts & Supplies | Circuit Board Assembly Products
MPM Accuflex Align card 1013084(1010729)REV B
Parts & Supplies | SMT Equipment
MPM Accuflex Align card P/N: 1013084(1010729)REV B Pls kindly contact with us at any time, if you are insterest more info about products. Website : www.ksunsmt.com Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323 Wha
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
Quad Placement System at IBE SMT Equipment More details here: http://www.ibesmt.com/Quad_QSV-1_Pick_Place/Flexible_Placers/3413/SMT.aspx
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Career Center | NEW DELHI, NEW DELHI India | Engineering
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Career Center | Danville, California | Sales/Marketing
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QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/1013084-mpm-accumflex-align-card-143749?page=740&order=name+asc
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