Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
New Equipment | Test Equipment
Measures DIO, Analog Voltage and Frequency in One Module. The JT 2149/DAF is a compact, mixed-signal (Digital/Analog/Frequency) measurement module and is the first unit of its type to offer both digital and analogue test access to PCBs via JTAG Tech
Electronics Forum | Thu Sep 12 20:55:39 EDT 2013 | marcelorotofrance
My own unit has an internal transformer also. It has multiple secondaries, and a divided primary which can be configured to the required voltage by changing jumpers. Best regards.
Electronics Forum | Tue Aug 07 14:39:55 EDT 2001 | SL
I and my fellows have been long term customers of Quad and recently purchased the nineth, I think, Quad machine a QSV as well as two stencil printers in the recent past. My experience with the Quad Corporation has been outstanding in terms of custom
Used SMT Equipment | Pick and Place/Feeders
Samsung / Quad Corp Quad QSA-30 SMT Pick& Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: C80006 Features: 3 Nozzle Head 1 Gantry Quad align on the fly heads 208V Power Requirement
Used SMT Equipment | Pick and Place/Feeders
Samsung / Quad Corp Quad QSA-30A SMT Pick & Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: C80122 Features: 3 Nozzle Head 1 Gantry Quad align on the fly heads 208V Power Requirement
Industry News | 2008-06-30 14:17:39.0
LOS ALAMITOS, CA � June 30, 2008 � Practical Dummy Components is now supplying the Amkor FusionQuad�, representing a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad� QFP and MLF� technologies.
Industry News | 2013-07-15 14:58:08.0
Mobility is the driving force in electronics.
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
"The completely re-engineered HOTFLOW 3/20 reflow oven has been designed to deliver the BEST in CLASS results for ALL AREAS that ultimately affect the bottom line profit per PCB. The days of investing in just any reflow oven that has the number of he
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Career Center | Santa Ana, California USA | Engineering
This position will have primary responsibility to develop, document, implement and maintain assembly processes for improved yield and process efficiency within Quality System requirements. We are looking for a multitask and organized individual with
Career Center | Bangalore-85, ka India | Production
As a Sr.Technician involved in production activities like programming, taking care of the production, process, rectifying the process problems, constantly getting in touch with the customers for any quality issues & other production activities, invol
Career Center | , | Maintenance,Management,Quality Control,Technical Support
Software: Over 14 years experience in operating and maintaining of different types of Telecommunication and IT equipments � Proven proficiency in operating and maintaining of TDM telecommunication equipment - digital exchanges AXE10 (Ericsson) � Pr
| https://pcbasupplies.com/tmt-2000s/
by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. Can be... MSRP: Now: $230.00 View Details Quick view Thermaltronics
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/why-invest-in-inventory-management
requirements of the FDA and the German RoV. Safety measures include supervised radiation warning lamps, a supervised mechanical door lock, a triple secured X-ray generator (interlock relay connected to door lock, mechanical circuit breaker for the X-ray power
