Global solutions for Electronics Manufacturing Services. 5 facilities featuring 17 Fuji & 16 Quad SMT lines, BGA & Micro BGA (Rework/2D X-ray), PTH, Flip Chip, COB, Prototype, ATE (Incircuit & Functional), Box Build, Fulfillment, DFM/DFT and Design.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
Equipment Broker - Used - SMT specialists - Quality Manufacturing Equipment Bought and Sold - Zevatech/Juki /MPM Specialists.
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Our facility we have the following equipment: Autoinsertion area: Sequencer machine VCD or Axial machine Radial machine Quad QSP2 SMT machine BTU Reflow oven Thruhole: Manual insertion line Wave solder SEHO machine
Electronics Forum | Mon Nov 29 18:23:19 EST 2010 | comprep
Has anyone had any success with placing BGAs with the Quad QSP-2? We have been having alignment issues with BGA placement but our placement of 0402 parts is dead on. We have worked through the calibration and it seems to be correct.
Electronics Forum | Thu Jun 12 10:55:02 EDT 2014 | lightinguk
Hi can some tell me how the setup the rt computer on the quad qsp2 , rt computer is not talking to the qsoft computer has anyone got any ideas ?
Used SMT Equipment | Pick and Place/Feeders
Mirae Corporation Quad Meridian - 1030P SMT Pick & Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: M3100-018 Features: 5 Nozzle Head 1 Gantry 4 Modular Heads 1 Precision Upward Precision Camera
Used SMT Equipment | Pick and Place/Feeders
good condition with many feeders and a lot of spare part!
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2008-04-08 23:29:59.0
Seoul, Korea � April 2008 � MIRTEC Co, LTD, the leading global manufacturer of AOI and AXI inspection systems announces it will showcase their complete line of inspection solutions in booth 4F10 at the upcoming NEPCON China/EMT China 2008 exhibition and conference, scheduled to take place April 8-11, 2008 in Shanghai, PR China.
Parts & Supplies | Pick and Place/Feeders
Quad Vibratory feeder Quan. 77 Specifications Applicable models : APS-1, QSA-30A, QSA-30V, QSA-60, QSA-60V, QSP-2, QSV-W, QSV-1, QSX-1, IIC, IIIC Feeder width : 76mm (3") Number of pitches : 8 Tube Cassette Width : 70mm (2.75") Electrical Connection
Parts & Supplies | Pick and Place/Feeders
Quad Vibratory feeder Quan. 77 Specifications Applicable models : APS-1, QSA-30A, QSA-30V, QSA-60, QSA-60V, QSP-2, QSV-W, QSV-1, QSX-1, IIC, IIIC Feeder width : 76mm (3") Number of pitches : 8 Tube Cassette Width : 70mm (2.75") Electrical Connection
This video presents how to replace and inspect BGA on PCB with our BGA rework station R720 & X ray inspection machine X6600. More details, pls contact me: WhatsApp?+86 18779975930 Skype?joyrongzhuomao@outlook.com Email: sales25@zhuomao.com.cn Link
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Wed Jun 20 00:00:00 EDT 2018 | ,
Everything You Need to Know About X-Rays
Career Center | Asheville, North Carolina USA | Production
Person needs to have Quad QSP-2 schooling or 2-3years experience in operating and programing. Pay DOE
Career Center | Reading, Pennsylvania USA | Production,Technical Support
Job Title: Surface Mount Technology Operator Department: Production Department Reports To: Production Manager FLSA Status: Non-Exempt Summary: Responsible for monitoring, maintaining, and adjusting equipment used to create electronic circuits w
Career Center | Bangalore-85, ka India | Production
As a Sr.Technician involved in production activities like programming, taking care of the production, process, rectifying the process problems, constantly getting in touch with the customers for any quality issues & other production activities, invol
Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALLWINNER&PN=H3
: Active Mounting Type: Surface Mount Logical Description: IC, Quad-Core OTT Box Processor Physical Description: Ball Grid Array (BGA), 0.65 mm pitch, square; 347 pin, 14.00 mm L X 14.00 mm W X 1.18 mm H body Commonly Visited: Discussion Forum Software User Guide Free Downloads Contact us Websites Contact Sales, Training, Support
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Anderson, Ph.D. Abstract 27-2 Reliability Degradation of SAC105 and SAC305 BGA Packages Under Long-Term, High Temperature Aging Zhou Hai, Jiawei Zhang, Chaobo Shen, E. K. Snipes, J. C. Suhling, M. J. Bozack and J. L. Evans Abstract 27-2 3-D Fracture Analysis
