Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Electronics Forum | Wed Dec 17 09:41:24 EST 2014 | dragonslong
1 x 10^10 ohm. Can i use the same specs? 2) Similarly, do anyone have a guide of the pass/fail criterion for the DWV measurement for parylene on IPC-B-25A board? I had check the Mil-I-46058 test standard which had a pass/fail criterion of
Electronics Forum | Wed Oct 17 17:44:49 EDT 2001 | davef
What you do is reasonable. Some of these and other tests are covered in: * IPC-6011 - Generic Performance Specification For Printed Boards * IPC-6012A w A#1 - Qualification & Performance For Rigid Printed Boards
Industry News | 2003-03-06 08:29:50.0
Coretec experienced sequential growth in sales over the last four quarters and, while its yearly sales did decline, said its sales record still compares favorably
Industry News | 2003-04-08 14:01:01.0
Sparton's design engineering team is one of 265 worldwide members in the Motorola Design Alliance program.
Technical Library | 2012-11-27 14:06:48.0
Quality managers and line supervisors are routinely tasked with the responsibility of ensuring that the hand soldering process is under control. The method most commonly used is to measure the idle tip temperature of the soldering station and to use this reading as a benchmark of system compliance. This method, although popular is now being seriously questioned by many industry professionals as being irrelevant in qualifying true system process control. This document aims to present a practical view of what factors are important for successful hand soldering and to suggest an alternative procedure for qualification that is simple, repeatable and directly related to the effectiveness of the soldering station.
Technical Library | 2019-02-27 15:23:47.0
A study was performed to investigate, evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs), Leadless SMT devices, QFNs, connectors and passive devices to improve reliability. The supplier of the sole source, currently used underfill, has indicated they may discontinue its manufacture in the near future. The current underfill material is used on numerous circuit card assemblies (CCAs) at several sites and across multiple programs/business areas. In addition, it is used by several of our contract CCA suppliers.The study objectives include evaluation of material properties for down select, dispensability and rework evaluation for further down select, accelerated life testing for final selection and qualification; and process development to implement into production and at our CCA suppliers. The paper will describe the approach used, material property test results and general findings relative to process characteristics and rework ability.
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
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Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
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Qualification and Reliability of Microvias
Career Center | Florham Park, New Jersey USA | Engineering
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Evaluation and Qualification Factor to Determine
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. IPC-6012 Qualification and Performance Specification for Rigid Boards. This is the document which is used to qualify circuit boards as it defines conductor thickness and width, plating thickness for each class of product, and defines all the visual and internal
