Industry Directory | Media / Publisher / Online Resource
SLAS Technology is a peer-reviewed scientific journal published by the Society for Laboratory Automation and Screening in partnership with SAGE Publications
The LPA-1 Lead Paint Analyzer is a state-of-the-art XRF spectrum analyzing system for the quantitative measurement of lead in paint on any surface. The LPA-1 Analyzer provides a fast, accurate measurement of lead content in as little as 2 to 4 second
Specifications Using for the various screws adhesive with Anaerobic Adhesive 1)locks bolts ,prevents tampering stops corrosion 2)seals welds ,seals threaded pipe ,seals nicked threads • Glue will evenly dispensing inside the screw • Position place
Electronics Forum | Mon Jul 01 18:30:58 EDT 2002 | mcox
Remember! Empirical data will allow you to take advantage of the inherent continuity of quantitative variables.
Electronics Forum | Wed Mar 08 14:11:38 EST 2006 | mholz
I am looking for an industry standard �stock� note to place on our printed circuit board assembly drawings that will capture a level of cleanliness for an IPC-A-610 class 2 board assembly. I�m looking for some quantitative spec for cleanliness that w
Used SMT Equipment | Board Cleaners
Austin American Technology's Mega II cleaners are designed for high reliability, environmentally-friendly, solvent-based cleaning and testing applications. These closed-loop, solvent regenerative systems feature quantitative ionic contamination detec
Used SMT Equipment | In-Circuit Testers
Tektronix TDS540D Bandwidth: 500.0 MHz Channels: 4 500 Mhz oscilloscope The TDS 500D/700D oscilloscopes are the first in the TDS family of Digital Phosphor Oscilloscopes (DPOs) designed to keep pace with current and evolving needs in advanced e
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2014-10-06 17:27:56.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Technical Library | 2013-01-11 16:51:33.0
There have been claims in the industry that laser-cut electroformed nickel foil blanks provide stencil print performance comparable to electroformed stencils. A study was established to measure the quantitative differences in performance between the two during an independent lab study.
Technical Library | 2011-06-02 15:49:09.0
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs, ADCs, and memory. They are susceptible to electrical, mechanical and thermal modes of failure like other components on a printed circuit boa
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Link: https://www.ascen.ltd/Products/mask_making_machine/ disposable medical face mask manufacturing machine also known as face mask production line,dusk mask machine,disposable face mask making machine.It is automatic output,a face mask body machine
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Career Center | Quito, Ecuador | Sales/Marketing,Technical Support
Technical Sales (machinery, animal and plant protection products). Sales Forecast New Products (Bsss Diffusion Model).
Quantitative Evaluation of New SMT Stencil Materials Quantitative Evaluation of New SMT Stencil Materials High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues
Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability Modern electronics typically consist of microprocessors and other complex
ASCEN Technology | https://www.ascen.ltd/face_mask_making_machine/662.html
input.The preset type quantitative integration output,stacked neatly, never fragmented, sanitation and reliability. Manufacturer： ASCEN technology ASCEN team design full automation face mask making machine to satisfy for face mask mass production,the face mask equipment use for producing the disposable type face mask,medical face mask,N95 cup
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