New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Electronics Forum | Fri Jan 13 14:18:41 EST 2006 | mark
Hi, I would like to ask you how you test the PCB (electrical test) of first PCB before starting production.? What kind of equipment you are using? and method to confirm that components on PCB are correct (value, orientation, describtion, polarizatio
Industry News | 2003-03-05 08:43:24.0
Announced that Alan Rae, vice president of technology for Cookson Electronics, has joined the association's Corporate Advisory Council.
Industry News | 2012-07-11 16:49:45.0
As electronics manufacturers strive to keep costs of high density electronics in check, the potential of nanotechnology and its growing applications make it an extremely attractive technology worth examining.
Parts & Supplies | Pick and Place/Feeders
N310P917M PHOTO SENSOR SENSOR(原装全新) 5 A N310P916A OPTICAL FIBER CABLE,PLASTIC SENSOR(原装全新) 1 A N310E32T16P OPTICAL FIBER CABLE,PLASTIC SENSOR(原装全新) 1 A N1P61018NA OPTICAL INPUT OUTPUT UNIT 8
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
Events Calendar | Wed Apr 14 00:00:00 EDT 2021 - Wed Apr 14 00:00:00 EDT 2021 | ,
Puget Sound Webinar: PCB Design, Fabrication, and Assembly DFM Webinar
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/es-ES/divisions/adhesive-dispensing-systems/contact-nordson-adhesives/global-contacts/estonia
. Estonia Estonia Hansapakend OÜ Reti tee 4 Peetri kula, Rae vald
