Industry Directory | Consultant / Service Provider / Manufacturer
QCG, Inc. - Your Printed Circuit Board Design and Assembly support in hard to build technology such as Package on Package (PoP BGA), Dual row QFN / Multi row QFN and fine pitch bump die; all with competitive rates.
Industry Directory | Consultant / Service Provider / Manufacturer
Increase your productivity and improve the quality of your products with Orenda Automation’s complete range of pulverisers and granulators.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
New Equipment | Cleaning Equipment
Fully automatic online PCBA cleaning machine-SMS-6300 Fully automatic online PCBA cleaning machine-SMS-6300 1. On-line, large-volume PCBA cleaning system. 2. Large-flow cleaning method can effectively remove organic and inorganic pollutants such as
Electronics Forum | Tue Dec 18 15:05:58 EST 2001 | blnorman
What is the maximum allowable thermal ramp rate for wave solder. We have a "short" machine used for selective soldering. To get the boards up to temp, we need to exceed our normal 2�C/sec. Are there any IPC documents governing this process? Anyon
Electronics Forum | Tue Dec 18 16:49:17 EST 2001 | davef
J-STD-001 - Requirements For Soldered Electrical & Electronis Assemblies is the governing document. It defines no specific limits like you mention. It states words to the effect that preheating should not do bad things.
Used SMT Equipment | AOI / Automated Optical Inspection
Capture on the fly technology 3D Fusion Lighting (RGB+White LED's) 5 megapixel color imaging 2 top-down and 4 side angle cameras Quick set-up High speed, high defect coverage Low false failure rate Programmable conveyor for boards up to 20 x 2
Used SMT Equipment | General Purpose Equipment
Very Nice Blue M Oven For Sale See attached pictures and information below Equipment Description Blue M Oven Model Number: CC-09-C-P-E Serial Number: T02G-339526-TG Pro Master Temperature Controller Temperature Range: 350C 6 - 8 degrees/m
Industry News | 2016-07-16 13:32:29.0
Advanced dispense technology is available for integration into your dispensing system. Continuously Volumetric, drip-and-drool free dispense technology can now be retrofitted into your dispense robot. GPD Global's Volumetric PCD pumps ensure the success of applications like underfill, LED encapsulation, solder mask, silicones, conductive ink, conformal coatings, and more. Improve your throughput and yields by retrofitting a Volumetric PCD Pump into your dispense system to simplify the dispense process.
Industry News | 2016-12-09 23:33:42.0
GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.
Parts & Supplies | Pick and Place/Feeders
SANYO stick feeder GSF-R01 SANYO 5000 Stick Feeder The operation rate of the machine is improved by the ability of stick feeder to operate continuously over an extended period. Unlike traditional stick feeders that rapidly vibrate u
Parts & Supplies | Pick and Place/Feeders
GSF-R09 UNIVERSAL Stick Feeder GSF-R09 UNIVERSAL Stick Feeder The operation rate of the machine is improved by the ability of stick feeder to operate continuously over an extended period. Unlike traditional stick feeders that rapidly vi
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. The Nordson YESTECH FX-940U
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
ENERGY1 - TECHNICAL CONSULTANT FOR POWER , UTILITIES AND MANUFACTURING
Career Center | 94539, California USA | Management
Responsible for ensuring customer fill rate and inventory goals are met. Analyze sales forecasts, history, and inventory to develop supply capacity plans. Day to Day Materials Management – manage material supply and demand including demand lo
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support
- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_qualmark_halt_hass.html
: 392F to -148F or 200C to -100C Ramp Rate: 70C/min. Heaters: 48kW Vibration: 5 - 50gRMS Table Size: 30" x 30" Inside Dimensions: 35" x 36" x 36" Outside Dimensions
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/it-IT/divisions/adhesive-dispensing-systems/industries/~/media/Files/Nordson/adhesive-dispensing-systems/Industry/Disposable-Hygiene/Nonwovens_OptiBond-Solutions-Brochure.pdf
delivery especially during production start. The simple Nordson variation management methodology is to Measure, Understand and Improve material delivery and dispensing during all phases of production including demanding ramp up and ramp down as
