Industry Directory | Manufacturer
Dynamic Manufacturing specializes in Electronic Manufacturing Services: Surface Mount Printed Circuit Boards (PCB's), Through-hole PCB's, Prototyping, Testing, Inspection, Conformal Coating, Enclosures. Contract Design: Printed Circuit Boards, Temper
Feature: ● Desktop single bench cutting machine, Speeds of up to 100mm/s,positioning speed 500mm/s ● Cut continuously without interruption during loading and unloading ● High quality shaft system allows the system to quickly ramp,reduce the per
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Specification: Motor drive system Servo/stepper motor Spindle speed 50000r/s Cutting performance 500mm/s Drive system repeatability ±0.02mm
Used SMT Equipment | Soldering - Selective
Make: Nordson ACE Model: KISS 103ILDP Description: This is Dual Pot Inline selective soldering system, with two selective soldering machines, tied together that can be run independently OR as a single inline selective system. This syste
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Technical Library | 2023-03-13 19:12:56.0
Printed electronics (PE) is impacting almost every branch of manufacturing. The printing of electronics on mechanically flexible substrates such as plastic, paper and textile, using traditional printing techniques, provides novel applications for wearable and stretchable electronics. Government sponsored consortiums, universities, contract printers, startups and global manufacturers are developing processes to bring this technology to market faster, more costeffectively and at scale. By increasing the speed of technology adoption while following industrialization best practices, industry researchers aim to create processes that ramp up the scale of production for simple circuits and integrated conductive structures.
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SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
– ramp up too fast Same as soldering ball. Poor wetting – ramp up too slow Solder paste is oxidizing if the pre-heat too long. Pre-heat and soak zone (from 150°C to 180°C
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/ultralow.pdf
. PC mother boards with large BGA devices can also be run successfully with reduced blower speeds in ramp-up and cooling modules and full blower speed in reflow modules
