Industry Directory | Manufacturer
Dynamic Manufacturing specializes in Electronic Manufacturing Services: Surface Mount Printed Circuit Boards (PCB's), Through-hole PCB's, Prototyping, Testing, Inspection, Conformal Coating, Enclosures. Contract Design: Printed Circuit Boards, Temper
Feature: ● Desktop single bench cutting machine, Speeds of up to 100mm/s,positioning speed 500mm/s ● Cut continuously without interruption during loading and unloading ● High quality shaft system allows the system to quickly ramp,reduce the per
Specification: Motor drive system Servo / stepper motor Spindle speed 50000r/s Cutting performance 500mm/s Drive system repeatability ±0.02mm
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Technical Library | 2000-06-27 10:27:05.0
This paper shall discuss the appropriate guidelines and troubleshooting methods for reflow profiling, and in particular shall focus upon the benefits of implementing the linear ramp-to-spike profile.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/grnreflo.pdf
°C soak zone to a 290°C ramp-up zone and then into a 235°C reflow zone. In a forced convection oven, characterized by continuous air movement, maintaining separate zones at different temperatures in close proximity to each other poses a significant engineering challenge
