Data Physics supplies vibration controllers, dynamic analysers, shakers and transducers for stress screening and vibration test applications.
Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
If you'd like to purchase Wayne's minimal-mathematics, minimal-theory hardbound text �Random Vibration & Shock Testing, Measurement, Analysis & Calibration� in addition to the Distance Learning Program, you can get a discount when buying Combo1.
Equipment Reliability Institute (ERI) offers Wayne Tustin's minimal-mathematics, minimal-theory hardbound text �Random Vibration & Shock Testing, Measurement, Analysis & Calibration�. This 4-color 444 printed pages book also includes a CD-ROM with vi
Electronics Forum | Thu Aug 27 07:56:24 EDT 2015 | grimus
Hello Do You have any experience with Device/Equipment that could make video recording inside inline reflow oven located after soldering PCB? I am facing with random problem with dropped parts inside reflow oven and I would like to see what is going
Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless
Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to
Used SMT Equipment | Pick and Place/Feeders
Panasonic CM602-L high-speed module placement machine, CM602-L placement machine not only follows the original module of Panasonic CM402, but also adds 12 nozzle high-speed head and direct suction tray as needed. The function of the original 8 nozzle
Used SMT Equipment | Pick and Place/Feeders
Panasonic CM602-L high-speed module placement machine, CM602-L placement machine not only follows the original module of Panasonic CM402, but also adds 12 nozzle high-speed head and direct suction tray as needed. The function of the original 8 nozzle
Industry News | 2003-02-19 15:27:49.0
March 18-20, 2003
Industry News | 2003-04-01 20:08:24.0
April 30 - May 2, 2003 in Mississauga, Canada
Technical Library | 2014-10-30 01:48:43.0
The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly. We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed
Technical Library | 2021-09-15 19:00:35.0
This paper presents the use of physics of failure (PoF) methodology to infer fast and accurate lifetime predictions for power electronics at the printed circuit board (PCB) level in early design stages. It is shown that the ability to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies allows, for instance, the prediction of solder fatigue failure due to thermal, mechanical, and manufacturing conditions. The technique allows a lifecycle prognosis of the PCB, taking into account the environmental stresses it will encounter during the period of operation. Primarily, it involves converting an electronic computer aided design (eCAD) circuit layout into computational fluid dynamic (CFD) and finite element analysis (FEA) models with accurate geometries. From this, stressors, such as thermal cycling, mechanical shock, natural frequency, and harmonic and random vibrations, are applied to understand PCB degradation, and semiconductor and capacitor wear, and accordingly provide a method for high-fidelity power PCB modelling, which can be subsequently used to facilitate virtual testing and digital twinning for aircraft systems and sub-systems.
Panasonic CM602-L high-speed module placement machine, CM602-L placement machine not only follows the original module of Panasonic CM402, but also adds 12 nozzle high-speed head and direct suction tray as needed. The function of the original 8 nozzle
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20060405647
:00AM Lehua/Hau A Case Study of Nickel Dendritic Growth on Printed Circuit Boards *Prabjit Singh, Ph.D., IBM Corporation Milo PBGA Solder Stress Development Mechanism Analyses Under Random Vibration Yeong Kim, Inha University 10:00AM - 10:15AM Courtyard 10:15AM - 10
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-in-automotive-components-are-revolutionizing-the-industry/
. Reduced Electronic Noise Minimizing space between components in PCBs reduces electronic noise — random voltage variations due to electrical interference between components in a system
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