Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Industry Directory | Manufacturer
We guarentee to lower your product cost! With over 15 years experience, we are DIRECT CONTACTS of select Asian manufacturing companies and factories from The People's Republic of China, Philippines, and Hong Kong. This select group is well-established manufacturing experts within their industries. We have long term relations with each
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Electronics Forum | Sun May 31 16:00:33 EDT 1998 | Eric
Earl, I am not sure of your specifc application but we have a good system to easily reball your BGA's E-mail me at bgakit@concentric.net for more information. Thanks, Eric
Electronics Forum | Fri May 22 16:14:45 EDT 1998 | Earl Moon
I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). Earl Moon
Used SMT Equipment | Pick and Place/Feeders
Juki Chipshooter With Vision Centering Multi-Nozzle Laser Head (4 Nozzle) Vision Centering System installed for Ball recognition Front Trolley Option Rear Fixed Feeder Base Maximum Board Size: 18" x 20" Place 0201 Components, QFP, BGA and CSPs
Used SMT Equipment | Coating and Encapsulation
Stand Alone PVA 550 Conformal Coating Machine. One ES Spray Valve One Needle Valve One F Spray Valve X, Y and Z axis Tack ball teach pendant Windows based PC running Pathmaster 2.3 Reconditioning or Re-configuring available - RFQ Installation and Tra
Industry News | 2013-04-25 16:41:53.0
IPC Electronic System Technologies Conference (IPC ESTC), Tuesday, May 21, 2013, in Las Vegas.
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
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Parts & Supplies | Pick and Place/Feeders
JUKI MTC PX500060000 VACUUM PAD Other juki parts: PX060010000 AUTO SWITCH PX060013000 AUTO SWITCH PX060029000 AUTO SWITCH PX068502000 AUTO SWITCH PX500014000 PLUG PX5000500A0 BRACKET PX500051000 VACUUM PAD 4 PX500052000 VACUUM PAD 8 PX50005
Parts & Supplies | SMT Equipment
RE0500000K0 E-RING RE0500000KP E-RING 5 RE0600000K0 E-RING 6 RE0700000K0 E RING 7 RE0800000K0 E-SHAPED SNAP RING (8MM) RE0900000KP SNAP RING 9 RE1200000K0 E-RING 12 RO040100200 O RING RO060150100 RUBBER RING RO069180100 RUBBER RING RO080150
Technical Library | 2012-10-04 18:52:43.0
First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t
Technical Library | 1999-05-06 11:18:25.0
The trend toward surface-mount assembly processes is making ball-grid array (BGA) packaging a popular choice for many types of devices, forcing designers to re-examine cooling of these large packages. While devices in BGAs transfer more heat to the board than leaded devices, the style of BGA packages has a large influence on the ability to transfer heat through other pathways, such as a top-mounted heat sink. Physical characteristics of the BGA further constrain the thermal designer. It takes forethought in board design to successfully accommodate devices that require significant heat dissipation. Multiple solutions exist, however, for BGA packages of all types.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. BGA removal and replacement process. Inspection and interpreting x-ray results. BGA Re-Balling BGA pad Repair Flux Considerations for BGA's, LGA's and QFN's
| https://ipcapexexpo.org/education/call-for-technical-paper-form
2.5-D/3-D Component Packaging BGA Packaging Connectors Design for Excellence (DFX) Design for Manufacturability (DFM) Design for Test (DFT) Die attach Embedded Passive and Active Devices Flexible Circuits Flip Chip/0201 Metric Package on Package Printed Electronics RFID Circuitry Re-balling Components Semiconductor Wire Bonding Other
