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Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
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, °C Pe rc en t o f r oo m te m pe ra tu re v al ue Dielectric constant (60 Hz) Dielectric strength 1) ASTM D-149 using 50 mm (2 inches) electrodes, rapid rise
