Send the Special Express To Others Email this Special Express to: Your friend Your co-worker A decision maker in your company A Colleague NOTE: You may re-use this e-mail form as many times
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/es-ES/divisions/efd/products/valves?nor_division_facet_a=f1ad4d3e7ba64f8ca819b442f90dd417%7C2c2d807b0ff8420a928d23d9cc5d1366%7C9e7ed2a09fd94f74a4aa2d1b5cb2c680&con=t&page=13
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
% 90% 100% 0 200 400 600 800 1000 1200 Cycles C u m u la ti ve F ai lu re s U1 U11 U15 U24 overall Figure 15: Failure Distributions for BGA56, by Reference Designator, With Typical Voids BGA 56 - with voids 0% 20% 40% 60% 80% 100% 120% 0 200 400 600 800
