New Equipment | Solder Materials
CAS: 68333- 69-7 Rosin Modified Maleic Resins is a light yellow transparent solid, which is synthesized by the addition reaction between gum rosin and maleic anhydride, then through the sterification with glycerol and pentaerythritol. Acid value
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
Electronics Forum | Tue Feb 28 14:32:26 EST 2006 | masrimhd
As I know, the encapsulation effect occurs only with rosin based fluxes. So if you have a PBA soldered using RA Flux, you should either wash it well, or leave it alone and it will be safe. For NC process the story is different because there�s no re
Electronics Forum | Tue Apr 05 15:31:15 EDT 2005 | Carmine Garboza
A dermatologist should be consulted. Contact allergies are tricky things and you can develop one from repeted exposure to almost anything. I've seen rashes breakout on my personell from wriststraps metal buckels, IC lotions, rubber gloves, finger cot
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2021-05-24 04:37:04.0
HVAC stands for heating, ventilation, and air conditioning. This system provides heating and cooling to residential and commercial buildings. These systems use fresh air from the outdoors to provide high indoor air quality. The V in the HVAC or ventilation is the process or replacing or exchanging air within a space.
Technical Library | 1999-05-07 10:47:00.0
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence.
Technical Library | 2010-07-08 19:56:15.0
As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
GPD Global | https://www.gpd-global.com/co_website/pdf/pump/Phosphors-LED.pdf
. Heating occurs in phosphor firing furnaces, which can hold anywhere from 100 grams to several kilograms of material. Once the phosphors have been heated under an atmosphere of nitrogen or similar inert gases and the reaction is complete, material is removed, reground and may be washed in either water or organic
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
additives all have an impact on controlling the above properties. This section will provide a summary on the impact of each of the common additives, specifically on effecting Cu dissolution from a metallurgical point of view. Kinetics of Cu Dissolution Before
