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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
Electronics Forum | Mon Apr 26 11:04:53 EDT 1999 | Dave F
| | Earl said, in essence: | | | | | Justin is absolutely right ... | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those coatings chemi
Electronics Forum | Mon Apr 26 17:45:26 EDT 1999 | Earl Moon
| | | Earl said, in essence: | | | | | | | Justin is absolutely right ... | | | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those
: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3) when in Rev E of J-STD-001 it was a process indicator (P2D3
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
(Electroless Nickel Immersion Gold): Provides excellent solderability and corrosion resistance. Commonly used for high-reliability applications
