Electronics Forum | Wed Oct 24 02:09:34 EDT 2018 | simondsr
Hi everyone, I am new to this SMT. I have just graduated my study, have zero experience in SMT industry as I studied Automotive before. Ok lets proceed to the main objetive, I have a question regarding package rebake. From what I have learned, the
Electronics Forum | Wed Jan 09 01:22:39 EST 2019 | kenneth0
Hi Simond, The baking process is likely to remove any moisture after the cleaning process. We wouldn't want any moisture trapped as this might cause delamination if the package is subject to subsequent heating/reflow process. Hence there's a staging
SMTnet Express, April 17, 2014, Subscribers: 22675, Members: Companies: 13858, Users: 36080 A Novel Low Temperature Fast Flow And Fast Cure Reworkable Underfill Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. In order to meet
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