S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection. High-speed solder joint inspection. Highest inspection depth. Simple operation. In today's electronics manufacturing environment, reliable and econ
Electronics Forum | Thu Apr 12 13:21:59 EDT 2018 | emeto
Hello fellow experts! Does anyone have a SPI machine that can calculate Cpk for the solder paste height across the PCB or for selected locations? Any feedback will be appreciated.
Electronics Forum | Thu Apr 12 16:50:44 EDT 2018 | esoderberg
Parmi SPI does CPK
Industry News | 2018-09-06 12:12:07.0
GPD Global offers the ideal tabletop robots (Catalina Series) for precision dispensing.
Industry News | 2008-07-03 21:21:50.0
OXFORD, CT � July 2, 2008 � MIRTEC Co. Ltd. announces that sales revenue for its North American Sales and Service Division grew by more than 81 percent for the first six months of fiscal 2008 with respect to 2007 results.
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
SMT Stencil Printers for PCB Assembly ETA high accuracy PCB printing machine, solder paste printer, automatic stencil printer with best quality and service. ❙ Introduce of PCB Printing Machine 1.Using linear guide-ways, matching
Semi Automatic Solder Paste Printer for SMT Line ETA high accuracy PCB printing machine, solder paste printer, automatic stencil printer with best quality and service. ❙ Introduce of PCB Printing Machine 1.Using linear guide-way
SMTnet Express, April 16, 2015, Subscribers: 22,628, Members: Companies: 14,302, Users: 38,055 Stereo Vision Based Automated Solder Ball Height Detection Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits by Mike Riddle , ASC
Lewis & Clark | http://www.lewis-clark.com/product-tag/solder-paste-inspection/
: USA / FOB Origin Availability: Immediate for purchase / 2-4 weeks for shipping 2011 Pemtron TROI-5500HL Solder Paste Inspection System Make: Pemtron Model
| https://www.wesource.com/aoi/cyberoptics-se500-solder-paste-inspection-id-140068-3/23/
: CyberOptics SE500 Solder Paste Inspection System Model: Accurate 3-D SPI Serial Number: 60006 Notes: The SE500 provides 3-D height, volume and area measurements for PCB's with CSPS, micro-BGAs, 0201s, 01005s and other small pad sizes for which measuring solder volume is critical in verifying solder joint reliability. Vintage: Nov. 2009 Asset
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