Industry News: reducing stencil aperture to solve solder bridging (13)

FCT Assembly to Exhibit Innovative Pastes and Stencils at OctoberBest

Industry News | 2014-09-09 21:35:30.0

FCT Assembly today announced plans to exhibit in Booth # I105 at OctoberBest 2014, scheduled to take place Wednesday, October 1, 2014 at Tektronix in Beaverton, OR.

FCT ASSEMBLY, INC.

FCT Assembly to Exhibit at Local SMTA Rocky Mountain Expo

Industry News | 2015-01-25 15:51:36.0

FCT Assembly today announced plans to exhibit at the SMTA Rocky Mountain Expo Tech Forum, scheduled to take place Wednesday, Jan. 28, 2015 at the West Club at Mile High Stadium in Denver, CO. Solder experts will be available to discuss FCT’s NanoSlic® Gold stencil and line of solution driven solder pastes.

FCT ASSEMBLY, INC.

Career Center - Resumes: reducing stencil aperture to solve solder bridging (1)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: reducing stencil aperture to solve solder bridging (1039)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo

Partner Websites: reducing stencil aperture to solve solder bridging (2)

Calendar of Events

Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm

. Through hole paste reflow can benefit using solder bricks to increase joint volume and decrease flux residues. Some placement machine suppliers offer produced cut and form feeders, so solder wire is used, reducing the cost of simple preforms Back in the day the presenter used preforms with vapour phase and

Surface Mount Technology Association (SMTA)


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