http://www.flason-smt.com/product/Samsung-nozzle-of-TN-series-CN-sereis.html Samsung nozzle of TN series & CN sereis SMT Nozzle Samsung Nozzle Samsung nozzle of TN series & CN sereis Usage:Samsung pick and place machine Product descriptio
http://www.flason-smt.com/product/Samsung-nozzle-of-TN-series-CN-sereis.html Samsung nozzle of TN series & CN sereis SMT Nozzle Samsung Nozzle Samsung nozzle of TN series & CN sereis Usage:Samsung pick and place machine Product descri
Electronics Forum | Mon Mar 05 12:52:06 EST 2007 | DC
Any one have experience of MyData paste jet printing? I don't ave chance to take a look at Apex but it can reduce the paste, no stencil required and paste volume control by programming.
Electronics Forum | Wed Mar 14 00:44:22 EDT 2007 | Yngwie
Thanks for the reply Dave. :) No, we dont toss in 500g on the stencil. Have you heard of any method to convert the solder paste to solder bar, just in case someone have done that before? Thanks.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Technical Library | 2017-03-22 20:58:08.0
Water soluble lead-free solder paste is widely used in today’s SMT processes, but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shift in usage of solder paste is driven by an effort to eliminate the water wash process. Some components cannot tolerate water wash and elimination of water washing streamlines the SMT process. Despite this shift, certain applications lend themselves to the use of water soluble solder paste.This paper details the research and development of a new water soluble lead-free solder paste which improves on the performance characteristics of existing technologies.
Technical Library | 2021-04-21 19:28:30.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness.
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SMTnet Express, April 7, 2022, Subscribers: 25,732, Companies: 11,564, Users: 27,174 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a
When It Comes to Cost Reduction, Variation and Waste are the Enemy News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! When It Comes to Cost Reduction, Variation and Waste
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/standards/ipc-j
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2306&OB=ASC.html
. The solder paste size is the same as the pad size. My assembly team is telling me that there is too much solder on the pads and that we should reduce the size of the aperture for the solder past screen
