Industry Directory | Manufacturer
As a manufacturer of reflow soldering systems with convection or condensation and drying and coating systems, Rehm Thermal Systems has been producing energy-efficient manufacturing equipment for the electronics and photovoltaics.
Industry Directory | Manufacturer
As leading cleaning technology company in China, we have more than 15 years experiences in SMT, Semi-conductor and Screen printing cleaning industries.
New Equipment | Cleaning Equipment
QYSMT MOREL Pneumatic fixture cleaning machine SMS-5100 SMS-5100 Pneumatic fixture cleaning machine, both solvent and water-based cleaning fluid; mainly used for regular cleaning of reflow soldering fixtures/trays in the SMT industry; can also be
Ersa HOTFLOW 4/20 Reflow Oven Ersa HOTFLOW 4/20 Ersa Reflow Oven Ersa HOTFLOW Reflow Oven Ersa HOTFLOW 4/20 Reflow Oven Product description: Ersa HOTFLOW 4/20 Reflow Oven INQUIRY Ersa HOTFLOW 4/20 Reflow Oven Products descripti
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-S720-A MACHINE Hardware Configuration Image signal input unit Main unit Power supply Air Camera Illumination Image resolution Feed method Line height PCB carrier width adjustment Ambient operating temperature Ambient opera
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2020-11-24 23:12:27.0
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.
Technical Library | 2019-07-02 23:02:05.0
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.This paper will give more detailed information of catalyst systems during development and performance in production lines.
VIGON® RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. Also, it removes re-condensed fluxes and emissions from condensation traps and heat exchange
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
SMTnet Express, December 14, 2023, Subscribers: 25,234, Companies: 11,964, Users: 28,558 █ Electronics Manufacturing Technical Articles How to Manage Material Outgassing in Reflow Oven In a lead-free reflow process, temperatures
SMTnet Express, July 28, 2022, Subscribers: 25,269, Companies: 11,590, Users: 27,367 █ Electronics Manufacturing Technical Articles How to Manage Material Outgassing in Reflow Oven In a lead-free reflow process, temperatures are higher
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/reflowevolution.pdf
Reflow Evolution Reduces Costs, Improves Reliability Reflow Evolution Reduces Costs, Improves Reliability New solder reflow technology is resulting in lower nitrogen consumption and significant cost
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2365.html
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