PCB/PWB manufacturer, single sided, double sided PTH, multilayer, flexible, screen printing, NC Milling, DIY supplies
Industry Directory | Manufacturer
MULTILAYER, Double sided and FLEX-RIGID PWB's. QUICK TURN and PRODUCTION.
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
1, All the main parts of the equipment are imported parts, long service life. 2, using the upper and lower two temperature control area, using PID automatic fuzzy temperature control system, high precision temperature control, high stability, tempera
Electronics Forum | Tue Jun 13 21:53:31 EDT 2000 | Dave F
This site is dedicated to double sided reflow and solder balls. Wasssup?
Electronics Forum | Tue Jun 13 21:18:02 EDT 2000 | sachi
is there a site or any information available for double sided reflow? Our compnay is rather new to this proceess and before we get deep i'd like to know more about it.
Used SMT Equipment | Pick and Place/Feeders
JUKI RX-6R Compact Modular SMT Mounter Placement speed Chip : 52,000CPH*2IC : 14,000CPH*3 Component size 0402mm(01005 inch) ~ 50mm×50mm*40402mm(01005 inch) ~ 100mm×100mm / 50×180mm*5 Board size Single lane conveyor:50×50 ~ 610×590 / 905×590(
Used SMT Equipment | Soldering - Reflow
Heller 1088HAC 4-zone computer controlled convection reflow oven w/ mesh belt, PC, manuals and some frames for double sided boards and spare parts are included. Unit was used lightly in PB free environment. Would be ideal for a area that needs sm
Industry News | 2018-10-18 08:53:06.0
Mixed process of SMT reflow oven
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | SMT Equipment
JUKI YC or Z GREASE MGREAS050GA 40031411 BARE ADJUSTMENT JIG 40031620 LOAD CELL ASM HLC-5N 40031754 I-CX PCB 40031812 LINEAR SCALE X ASM 40031860 Y BEAR CABLES ASM 40031861 XY BEAR HEAD CABLES ASM 40032048 IN STEPPING MOTOR ASM 40032049 OUT
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
JUKI KE-3020VA High-Speed Flexible SMT Placement ❙ Introduce of JUKI KE-3020VA JUKI KE-3020VA pick and place machine, JUKI High-speed flexible SMT chip mounter, JUKI SMT placement, From 0402(01005) to 74mm square components or 50&
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Career Center | , | Engineering,Production
Manufacturing Engineer - AOI Will develop, implement, and maintain PCB assembly processes including screen printing, placement, reflow, and automated optical inspection. Will be process owner for AOI equipment. Requires: BS Engineering Th
Career Center | faridabad, India | Engineering,Production,Quality Control
My technical proficiency is extensive and is summarized on my resume (attached). As reflected on my resume (attached) I have completed my B-tech this Year.I am a fresher Electronics Engineer but having 6 months of PCB Assembling,PCB Manufacturing and
Career Center | faridabad, India | Engineering,Production,Quality Control
My technical proficiency is extensive and is summarized on my resume (attached). As reflected on my resume (attached) I have completed my B-tech this Year.I am a fresher Electronics Engineer but having 6 months of PCB Assembling,PCB Manufacturing and
An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing
An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
. On the other hand, a shorter oven also can be used to achieve the same throughput and to conserve fac- tory floor space. No. 2 — Avoid Reflow of Double-sided PCBs
| https://www.smtfactory.com/Introduction-of-Lyra-Reflow-Oven-s-process-development-stage-id3093448.html
. Large, suitable for reflow soldering and heating of double-sided assembled substrates. This type of Lyra Reflow Oven can be said to be the basic type of reflow oven
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