PCB/PWB manufacturer, single sided, double sided PTH, multilayer, flexible, screen printing, NC Milling, DIY supplies
Industry Directory | Manufacturer
MULTILAYER, Double sided and FLEX-RIGID PWB's. QUICK TURN and PRODUCTION.
High quality smt reflow soldering machine for sale Features: HR Series High End/Nitrogen Reflow Soldering Machine ¤Suitable For High End Products/Critical Process Criteria ¤6, 8, 10, 12 Heating Zones Available ¤Single/Dual Lane Configuration
Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and
Electronics Forum | Tue Jun 13 21:53:31 EDT 2000 | Dave F
This site is dedicated to double sided reflow and solder balls. Wasssup?
Electronics Forum | Tue Jun 13 21:18:02 EDT 2000 | sachi
is there a site or any information available for double sided reflow? Our compnay is rather new to this proceess and before we get deep i'd like to know more about it.
Used SMT Equipment | Pick and Place/Feeders
JUKI RX-6R Compact Modular SMT Mounter Placement speed Chip : 52,000CPH*2IC : 14,000CPH*3 Component size 0402mm(01005 inch) ~ 50mm×50mm*40402mm(01005 inch) ~ 100mm×100mm / 50×180mm*5 Board size Single lane conveyor:50×50 ~ 610×590 / 905×590(
Used SMT Equipment | Soldering - Reflow
Heller 1088HAC 4-zone computer controlled convection reflow oven w/ mesh belt, PC, manuals and some frames for double sided boards and spare parts are included. Unit was used lightly in PB free environment. Would be ideal for a area that needs sm
Industry News | 2022-12-14 12:21:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | SMT Equipment
JUKI YC or Z GREASE MGREAS050GA 40031411 BARE ADJUSTMENT JIG 40031620 LOAD CELL ASM HLC-5N 40031754 I-CX PCB 40031812 LINEAR SCALE X ASM 40031860 Y BEAR CABLES ASM 40031861 XY BEAR HEAD CABLES ASM 40032048 IN STEPPING MOTOR ASM 40032049 OUT
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
JUKI KE-3020VA High-Speed Flexible SMT Placement ❙ Introduce of JUKI KE-3020VA JUKI KE-3020VA pick and place machine, JUKI High-speed flexible SMT chip mounter, JUKI SMT placement, From 0402(01005) to 74mm square components or 50&
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | , | Engineering,Production
Manufacturing Engineer - AOI Will develop, implement, and maintain PCB assembly processes including screen printing, placement, reflow, and automated optical inspection. Will be process owner for AOI equipment. Requires: BS Engineering Th
Career Center | faridabad, India | Engineering,Production,Quality Control
My technical proficiency is extensive and is summarized on my resume (attached). As reflected on my resume (attached) I have completed my B-tech this Year.I am a fresher Electronics Engineer but having 6 months of PCB Assembling,PCB Manufacturing and
Career Center | faridabad, India | Engineering,Production,Quality Control
My technical proficiency is extensive and is summarized on my resume (attached). As reflected on my resume (attached) I have completed my B-tech this Year.I am a fresher Electronics Engineer but having 6 months of PCB Assembling,PCB Manufacturing and
An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing
An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
. On the other hand, a shorter oven also can be used to achieve the same throughput and to conserve fac- tory floor space. No. 2 — Avoid Reflow of Double-sided PCBs
| https://www.smtfactory.com/Introduction-of-Lyra-Reflow-Oven-s-process-development-stage-id3093448.html
. Large, suitable for reflow soldering and heating of double-sided assembled substrates. This type of Lyra Reflow Oven can be said to be the basic type of reflow oven
